Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites
A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes...
Gespeichert in:
| Veröffentlicht in: | Journal of applied polymer science 2011-07, Vol.121 (2), p.916-922 |
|---|---|
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 922 |
|---|---|
| container_issue | 2 |
| container_start_page | 916 |
| container_title | Journal of applied polymer science |
| container_volume | 121 |
| creator | Li, Tung-Lin Hsu, Steve Lien-Chung |
| description | A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m−1 K−1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011 |
| doi_str_mv | 10.1002/app.33631 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_901655966</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>901655966</sourcerecordid><originalsourceid>FETCH-LOGICAL-c4631-2f4cf89c9f15982aef4b1443afeaf8ee30e45683cb8bb4c72b9b175d1321ab113</originalsourceid><addsrcrecordid>eNp1kM1u1DAURi0EEkNhwRtEQgixSMc3_km8LCMolUqZRRESG8vxXGtcEjvYGWDeHtO0XSCxsq58vuPrj5CXQE-B0mZtpumUMcngEVkBVW3NZdM9JqtyB3WnlHhKnuV8QymAoHJF9tuEk0lm9jFUJuyqKcUJ0-wxV9FV8x7TaIbhWNkYdgc7-59YTfs4x4wh-2WMw9GPfofrPqZiCX5OZaqCCdHGcYqFw_ycPHFmyPji7jwhXz68v958rC8_n19szi5ry8vWdeO4dZ2yyoFQXWPQ8R44Z8ahcR0io8iF7Jjtu77ntm161UMrdsAaMD0AOyFvFm_5yI8D5lmPPlscBhMwHrJWFKQQSspCvvqHvImHFMpyGgTItmNM0EK9XSibYs4JnZ6SH006aqD6b-W6VK5vKy_s6zujydYMLplgfX4INBxo296-vF64X37A4_-F-my7vTfXS8LnGX8_JEz6rmXLWqG_Xp3rq2v4tGnefdOU_QG1AqE5</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1516783350</pqid></control><display><type>article</type><title>Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Li, Tung-Lin ; Hsu, Steve Lien-Chung</creator><creatorcontrib>Li, Tung-Lin ; Hsu, Steve Lien-Chung</creatorcontrib><description>A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m−1 K−1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</description><identifier>ISSN: 0021-8995</identifier><identifier>ISSN: 1097-4628</identifier><identifier>EISSN: 1097-4628</identifier><identifier>DOI: 10.1002/app.33631</identifier><identifier>CODEN: JAPNAB</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Applied sciences ; Boron nitride ; Composites ; Dispersions ; Exact sciences and technology ; Forms of application and semi-finished materials ; Heat transfer ; Materials science ; Nanocomposites ; Nanomaterials ; Nanostructure ; photoresists ; Polyimide resins ; polyimides ; Polymer industry, paints, wood ; Polymers ; Technology of polymers ; Thermal conductivity</subject><ispartof>Journal of applied polymer science, 2011-07, Vol.121 (2), p.916-922</ispartof><rights>Copyright © 2011 Wiley Periodicals, Inc.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c4631-2f4cf89c9f15982aef4b1443afeaf8ee30e45683cb8bb4c72b9b175d1321ab113</citedby><cites>FETCH-LOGICAL-c4631-2f4cf89c9f15982aef4b1443afeaf8ee30e45683cb8bb4c72b9b175d1321ab113</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fapp.33631$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fapp.33631$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27903,27904,45553,45554</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=24107766$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Li, Tung-Lin</creatorcontrib><creatorcontrib>Hsu, Steve Lien-Chung</creatorcontrib><title>Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites</title><title>Journal of applied polymer science</title><addtitle>J. Appl. Polym. Sci</addtitle><description>A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m−1 K−1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</description><subject>Applied sciences</subject><subject>Boron nitride</subject><subject>Composites</subject><subject>Dispersions</subject><subject>Exact sciences and technology</subject><subject>Forms of application and semi-finished materials</subject><subject>Heat transfer</subject><subject>Materials science</subject><subject>Nanocomposites</subject><subject>Nanomaterials</subject><subject>Nanostructure</subject><subject>photoresists</subject><subject>Polyimide resins</subject><subject>polyimides</subject><subject>Polymer industry, paints, wood</subject><subject>Polymers</subject><subject>Technology of polymers</subject><subject>Thermal conductivity</subject><issn>0021-8995</issn><issn>1097-4628</issn><issn>1097-4628</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp1kM1u1DAURi0EEkNhwRtEQgixSMc3_km8LCMolUqZRRESG8vxXGtcEjvYGWDeHtO0XSCxsq58vuPrj5CXQE-B0mZtpumUMcngEVkBVW3NZdM9JqtyB3WnlHhKnuV8QymAoHJF9tuEk0lm9jFUJuyqKcUJ0-wxV9FV8x7TaIbhWNkYdgc7-59YTfs4x4wh-2WMw9GPfofrPqZiCX5OZaqCCdHGcYqFw_ycPHFmyPji7jwhXz68v958rC8_n19szi5ry8vWdeO4dZ2yyoFQXWPQ8R44Z8ahcR0io8iF7Jjtu77ntm161UMrdsAaMD0AOyFvFm_5yI8D5lmPPlscBhMwHrJWFKQQSspCvvqHvImHFMpyGgTItmNM0EK9XSibYs4JnZ6SH006aqD6b-W6VK5vKy_s6zujydYMLplgfX4INBxo296-vF64X37A4_-F-my7vTfXS8LnGX8_JEz6rmXLWqG_Xp3rq2v4tGnefdOU_QG1AqE5</recordid><startdate>20110715</startdate><enddate>20110715</enddate><creator>Li, Tung-Lin</creator><creator>Hsu, Steve Lien-Chung</creator><general>Wiley Subscription Services, Inc., A Wiley Company</general><general>Wiley</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20110715</creationdate><title>Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites</title><author>Li, Tung-Lin ; Hsu, Steve Lien-Chung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c4631-2f4cf89c9f15982aef4b1443afeaf8ee30e45683cb8bb4c72b9b175d1321ab113</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Applied sciences</topic><topic>Boron nitride</topic><topic>Composites</topic><topic>Dispersions</topic><topic>Exact sciences and technology</topic><topic>Forms of application and semi-finished materials</topic><topic>Heat transfer</topic><topic>Materials science</topic><topic>Nanocomposites</topic><topic>Nanomaterials</topic><topic>Nanostructure</topic><topic>photoresists</topic><topic>Polyimide resins</topic><topic>polyimides</topic><topic>Polymer industry, paints, wood</topic><topic>Polymers</topic><topic>Technology of polymers</topic><topic>Thermal conductivity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Li, Tung-Lin</creatorcontrib><creatorcontrib>Hsu, Steve Lien-Chung</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied polymer science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Li, Tung-Lin</au><au>Hsu, Steve Lien-Chung</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites</atitle><jtitle>Journal of applied polymer science</jtitle><addtitle>J. Appl. Polym. Sci</addtitle><date>2011-07-15</date><risdate>2011</risdate><volume>121</volume><issue>2</issue><spage>916</spage><epage>922</epage><pages>916-922</pages><issn>0021-8995</issn><issn>1097-4628</issn><eissn>1097-4628</eissn><coden>JAPNAB</coden><abstract>A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m−1 K−1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</abstract><cop>Hoboken</cop><pub>Wiley Subscription Services, Inc., A Wiley Company</pub><doi>10.1002/app.33631</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0021-8995 |
| ispartof | Journal of applied polymer science, 2011-07, Vol.121 (2), p.916-922 |
| issn | 0021-8995 1097-4628 1097-4628 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_901655966 |
| source | Wiley Online Library Journals Frontfile Complete |
| subjects | Applied sciences Boron nitride Composites Dispersions Exact sciences and technology Forms of application and semi-finished materials Heat transfer Materials science Nanocomposites Nanomaterials Nanostructure photoresists Polyimide resins polyimides Polymer industry, paints, wood Polymers Technology of polymers Thermal conductivity |
| title | Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T19%3A46%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Preparation%20and%20properties%20of%20thermally%20conductive%20photosensitive%20polyimide/boron%20nitride%20nanocomposites&rft.jtitle=Journal%20of%20applied%20polymer%20science&rft.au=Li,%20Tung-Lin&rft.date=2011-07-15&rft.volume=121&rft.issue=2&rft.spage=916&rft.epage=922&rft.pages=916-922&rft.issn=0021-8995&rft.eissn=1097-4628&rft.coden=JAPNAB&rft_id=info:doi/10.1002/app.33631&rft_dat=%3Cproquest_cross%3E901655966%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1516783350&rft_id=info:pmid/&rfr_iscdi=true |