Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation

Plasma-polymerized tetravinylsilane films deposited on silicon wafers by PECVD at different powers using pulsed plasma were analyzed by both typical conventional depth sensing and by cyclic nanoindentation. A comparative study of the two methods was carried out under reduced system drift. It was fou...

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Veröffentlicht in:	Surface & coatings technology 2011-07, Vol.205, p.S470-S474
Hauptverfasser:	Trivedi, R., Hoferek, L., Cech, V.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Coatings Cross-disciplinary physics: materials science rheology Deposition Drift Exact sciences and technology Hardness Materials science Mechanical properties Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Modulus of elasticity Nanoindentation Physics Plasma polymerization Silicon Surface treatments Thin film Young's modulus
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