Electromigration stress induced deformation mechanisms in free-standing platinum thin films

We present experimental evidence of anomalously high grain boundary mobility in 3–5 nm grain size platinum films at near room temperature. This mobility can be explained in terms of the localized electromigration stresses of the order of a few GPa that we observed. In the absence of conventional def...

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Veröffentlicht in:	Scripta materialia 2011-08, Vol.65 (4), p.277-280
Hauptverfasser:	Kumar, S., Alam, M.T., Connell, Z., Haque, M.A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Deformation mechanisms Dislocation mobility Electromigration Grain boundaries Grain growth Grain size Nanocrystalline microstructure Platinum Stresses Thin films Transmission electron microscopy
Online-Zugang:	Volltext
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