A novel approach to radiographic image resolution gauge fabrication

A resolution gauge was fabricated for measuring the spatial resolution of radiographic imaging systems. Silicon wafers, 100 mm 〈1 0 0〉, were patterned using standard contact lithography and the patterned features were etched using deep reactive ion etching (DRIE). The smallest features were 5 μm wid...

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Veröffentlicht in:Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Accelerators, spectrometers, detectors and associated equipment, 2011-08, Vol.646 (1), p.135-141
Hauptverfasser: Trivelpiece, C.L., Babcox, B.L., Brenizer, J.S., Wolfe, D.E., Adair, J.H.
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container_issue 1
container_start_page 135
container_title Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment
container_volume 646
creator Trivelpiece, C.L.
Babcox, B.L.
Brenizer, J.S.
Wolfe, D.E.
Adair, J.H.
description A resolution gauge was fabricated for measuring the spatial resolution of radiographic imaging systems. Silicon wafers, 100 mm 〈1 0 0〉, were patterned using standard contact lithography and the patterned features were etched using deep reactive ion etching (DRIE). The smallest features were 5 μm wide line pairs. The resulting etched trenches included aspect ratios of up to 10:1 and were 40.6±0.2 μm deep. The etch rate was 2.7 μm/min for the reported etch depth. A Gd 2O 3 nanopowder was dispersed into a slurry using Darvan C and water as the dispersant and solvent, respectively. A rapid infiltration method was used to fill the etched trenches with the slurry. Neutron and X-ray radiographs of the resolution gauge and the results demonstrate that the prototype gauge would be a suitable standard for measuring the spatial resolution of both X-ray and neutron radiography systems. ► We describe a method for producing radiographic image spatial resolution gauges. ► Gauge features sizes range from 2 mm to 5 μm. ► The production method yields deep features with nearly perfectly square edges. ► Gadolinium oxide nanopowder was the radiation attenuating medium. ► Results show that the device is suitable for X-ray and neutron radiography systems.
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Silicon wafers, 100 mm 〈1 0 0〉, were patterned using standard contact lithography and the patterned features were etched using deep reactive ion etching (DRIE). The smallest features were 5 μm wide line pairs. The resulting etched trenches included aspect ratios of up to 10:1 and were 40.6±0.2 μm deep. The etch rate was 2.7 μm/min for the reported etch depth. A Gd 2O 3 nanopowder was dispersed into a slurry using Darvan C and water as the dispersant and solvent, respectively. A rapid infiltration method was used to fill the etched trenches with the slurry. 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subjects Etching
Gages
Gauges
Image resolution
Image unsharpness
Nanostructure
Neutron imaging
Radiographic
Radiography
Rapid-infiltration
Slurries
Spatial resolution
Trenches
X-ray imaging
title A novel approach to radiographic image resolution gauge fabrication
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