Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array
We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation...
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| Veröffentlicht in: | IEEE journal of selected topics in quantum electronics 2006-09, Vol.12 (5), p.1045-1053 |
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| container_title | IEEE journal of selected topics in quantum electronics |
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| creator | Ogawa, I. Doi, Y. Hashizume, Y. Kamei, S. Tamura, Y. Ishii, M. Kominato, T. Yamazaki, H. Kaneko, A. |
| description | We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mmtimes55 mmtimes14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique |
| doi_str_mv | 10.1109/JSTQE.2006.882627 |
| format | Article |
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The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mmtimes55 mmtimes14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique</description><identifier>ISSN: 1077-260X</identifier><identifier>EISSN: 1558-4542</identifier><identifier>DOI: 10.1109/JSTQE.2006.882627</identifier><identifier>CODEN: IJSQEN</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Arrays ; Attenuators ; Chip scale packaging ; Chip-scale-package photodiode (PD) array ; Circuits ; Insertion loss ; Integrated optics ; Modules ; multichip planar lightwave circuit (PLC) integration ; Multiplexing ; Noise levels ; Optical arrays ; Optical attenuators ; Optical losses ; Optical polarization ; Packaging ; Product life cycle ; Programmable control ; silica-based PLC ; Vanadium ; variable optical attenuator multiplexer</subject><ispartof>IEEE journal of selected topics in quantum electronics, 2006-09, Vol.12 (5), p.1045-1053</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c324t-edcac2e0a9fc6d797906a7c22bffaf698ea339e0504a28c01170afb2510d96723</citedby><cites>FETCH-LOGICAL-c324t-edcac2e0a9fc6d797906a7c22bffaf698ea339e0504a28c01170afb2510d96723</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1707718$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>315,781,785,797,27928,27929,54762</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1707718$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ogawa, I.</creatorcontrib><creatorcontrib>Doi, Y.</creatorcontrib><creatorcontrib>Hashizume, Y.</creatorcontrib><creatorcontrib>Kamei, S.</creatorcontrib><creatorcontrib>Tamura, Y.</creatorcontrib><creatorcontrib>Ishii, M.</creatorcontrib><creatorcontrib>Kominato, T.</creatorcontrib><creatorcontrib>Yamazaki, H.</creatorcontrib><creatorcontrib>Kaneko, A.</creatorcontrib><title>Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array</title><title>IEEE journal of selected topics in quantum electronics</title><addtitle>JSTQE</addtitle><description>We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mmtimes55 mmtimes14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique</description><subject>Arrays</subject><subject>Attenuators</subject><subject>Chip scale packaging</subject><subject>Chip-scale-package photodiode (PD) array</subject><subject>Circuits</subject><subject>Insertion loss</subject><subject>Integrated optics</subject><subject>Modules</subject><subject>multichip planar lightwave circuit (PLC) integration</subject><subject>Multiplexing</subject><subject>Noise levels</subject><subject>Optical arrays</subject><subject>Optical attenuators</subject><subject>Optical losses</subject><subject>Optical polarization</subject><subject>Packaging</subject><subject>Product life cycle</subject><subject>Programmable control</subject><subject>silica-based PLC</subject><subject>Vanadium</subject><subject>variable optical attenuator multiplexer</subject><issn>1077-260X</issn><issn>1558-4542</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkc9uEzEQh1eISpTCAyAuFhfg4NT2_rH3GIVSilI1KEnLzZo4s4mLs7vYXok8Da-Kw1ZC4mCNpfnmNyN9WfaGswnnrL78ulx9u5oIxqqJUqIS8ll2zstS0aIsxPP0Z1JSUbHvL7KXITwyxlSh2Hn2ewHmB-xsuyMrNPu2c93uSJrOk7WLHujyAM6Re_AWNg7JXR-tAUemMWI7QEzc7eCi7R3-Qk8-3NPpw_VH8mDjfmyYve3JYj4jN23EnYdou5Ysox9MHDySdThtniWILlMu0vEcJItPZOo9HF9lZw24gK-f6kW2_ny1mn2h87vrm9l0Tk0uikhxa8AIZFA3ptrKWtasAmmE2DQNNFWtEPK8RlayAoQyjHPJoNmIkrNtXUmRX2Tvx9zedz8HDFEfbDDoHLTYDUGruuLp5TKR7_4jH7vBt-k4XXORgkueJ4iPkPFdCB4b3Xt7AH_UnOmTMP1XmD4J06OwNPN2nLGI-I-XyRxX-R99nZMp</recordid><startdate>20060901</startdate><enddate>20060901</enddate><creator>Ogawa, I.</creator><creator>Doi, Y.</creator><creator>Hashizume, Y.</creator><creator>Kamei, S.</creator><creator>Tamura, Y.</creator><creator>Ishii, M.</creator><creator>Kominato, T.</creator><creator>Yamazaki, H.</creator><creator>Kaneko, A.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20060901</creationdate><title>Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array</title><author>Ogawa, I. ; Doi, Y. ; Hashizume, Y. ; Kamei, S. ; Tamura, Y. ; Ishii, M. ; Kominato, T. ; Yamazaki, H. ; Kaneko, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c324t-edcac2e0a9fc6d797906a7c22bffaf698ea339e0504a28c01170afb2510d96723</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Arrays</topic><topic>Attenuators</topic><topic>Chip scale packaging</topic><topic>Chip-scale-package photodiode (PD) array</topic><topic>Circuits</topic><topic>Insertion loss</topic><topic>Integrated optics</topic><topic>Modules</topic><topic>multichip planar lightwave circuit (PLC) integration</topic><topic>Multiplexing</topic><topic>Noise levels</topic><topic>Optical arrays</topic><topic>Optical attenuators</topic><topic>Optical losses</topic><topic>Optical polarization</topic><topic>Packaging</topic><topic>Product life cycle</topic><topic>Programmable control</topic><topic>silica-based PLC</topic><topic>Vanadium</topic><topic>variable optical attenuator multiplexer</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ogawa, I.</creatorcontrib><creatorcontrib>Doi, Y.</creatorcontrib><creatorcontrib>Hashizume, Y.</creatorcontrib><creatorcontrib>Kamei, S.</creatorcontrib><creatorcontrib>Tamura, Y.</creatorcontrib><creatorcontrib>Ishii, M.</creatorcontrib><creatorcontrib>Kominato, T.</creatorcontrib><creatorcontrib>Yamazaki, H.</creatorcontrib><creatorcontrib>Kaneko, A.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE journal of selected topics in quantum electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ogawa, I.</au><au>Doi, Y.</au><au>Hashizume, Y.</au><au>Kamei, S.</au><au>Tamura, Y.</au><au>Ishii, M.</au><au>Kominato, T.</au><au>Yamazaki, H.</au><au>Kaneko, A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array</atitle><jtitle>IEEE journal of selected topics in quantum electronics</jtitle><stitle>JSTQE</stitle><date>2006-09-01</date><risdate>2006</risdate><volume>12</volume><issue>5</issue><spage>1045</spage><epage>1053</epage><pages>1045-1053</pages><issn>1077-260X</issn><eissn>1558-4542</eissn><coden>IJSQEN</coden><abstract>We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mmtimes55 mmtimes14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSTQE.2006.882627</doi><tpages>9</tpages></addata></record> |
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| identifier | ISSN: 1077-260X |
| ispartof | IEEE journal of selected topics in quantum electronics, 2006-09, Vol.12 (5), p.1045-1053 |
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| source | IEEE Electronic Library (IEL) |
| subjects | Arrays Attenuators Chip scale packaging Chip-scale-package photodiode (PD) array Circuits Insertion loss Integrated optics Modules multichip planar lightwave circuit (PLC) integration Multiplexing Noise levels Optical arrays Optical attenuators Optical losses Optical polarization Packaging Product life cycle Programmable control silica-based PLC Vanadium variable optical attenuator multiplexer |
| title | Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array |
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