System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip
Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. Thi...
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| Veröffentlicht in: | IEEE transactions on advanced packaging 2005-05, Vol.28 (2), p.310-319 |
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| creator | Jones, R.E. Ramiah, C. Kamgaing, T. Banerjee, S.K. Chi-Taou Tsai Hughes, H.G. De Silva, A.P. Drye, J. Li Li Blood, W. Qiang Li Vaughan, C.R. Miglore, R. Penunuri, D. Lucero, R. Frear, D.R. Miller, M.F. |
| description | Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device (IPD) provided redistribution and matching between the SAW filter output and the transceiver input. Both extended global system for mobile communications (EGSM) and DCS filters were evaluated. Results demonstrated that conventional packaging techniques could be used to successfully assemble stacked SAW on transceiver modules without damage. SAW compact models based on the coupling of modes model were developed to facilitate system design. Electromagnetic simulations of coupling between SAW filters and inductors integrated on the transceiver suggested that design care is needed to avoid interactions, especially if an IPD is not used as a spacer. With appropriate design, stacked SAW filter on transceiver offers viable module integration. |
| doi_str_mv | 10.1109/TADVP.2005.846935 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_896182844</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1427855</ieee_id><sourcerecordid>896182844</sourcerecordid><originalsourceid>FETCH-LOGICAL-c416t-c18ff68cf36af769dd98b441c9e645649365425dff1f4c7d7c4d33514869244f3</originalsourceid><addsrcrecordid>eNqNkV1LHTEQhpeiUL9-gHgTCtWrPc0kk2xyeTjVVhC0fvUypNlEY_fsniZ7RP99c3oEoRfi1Qy8zwzvzFtV-0AnAFR_uZ5-vb2YMErFRKHUXHyotkCIptZa0Y1Vz6DmnPGP1XbOD5QCKmRb1Y-r5zz6eR372tYL637bO09iP_q7ZMc49GQI5Gr6k1yekMsnEmI3-kTyWEDfkiJbMibbZ-fjYxHcfVzsVpvBdtnvvdSd6ubk-Hr2vT47_3Y6m57VDkGOtQMVglQucGlDI3XbavULEZz2EoVEzaVAJtoQIKBr2sZhy7kotqVmiIHvVEfrvYs0_Fn6PJp5LD66zvZ-WGajtATFFGIhD98kmZZKMPEOUAEAClrAT_-BD8My9eVcU-wBbQRCgWANuTTknHwwixTnNj0boGYVmvkXmlmFZtahlZnPL4ttdrYL5bcu5tdB2TSU6xV3sOai9_5VRtYoIfhfuyKdVA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>869107541</pqid></control><display><type>article</type><title>System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip</title><source>IEEE Electronic Library (IEL)</source><creator>Jones, R.E. ; Ramiah, C. ; Kamgaing, T. ; Banerjee, S.K. ; Chi-Taou Tsai ; Hughes, H.G. ; De Silva, A.P. ; Drye, J. ; Li Li ; Blood, W. ; Qiang Li ; Vaughan, C.R. ; Miglore, R. ; Penunuri, D. ; Lucero, R. ; Frear, D.R. ; Miller, M.F.</creator><creatorcontrib>Jones, R.E. ; Ramiah, C. ; Kamgaing, T. ; Banerjee, S.K. ; Chi-Taou Tsai ; Hughes, H.G. ; De Silva, A.P. ; Drye, J. ; Li Li ; Blood, W. ; Qiang Li ; Vaughan, C.R. ; Miglore, R. ; Penunuri, D. ; Lucero, R. ; Frear, D.R. ; Miller, M.F.</creatorcontrib><description>Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device (IPD) provided redistribution and matching between the SAW filter output and the transceiver input. Both extended global system for mobile communications (EGSM) and DCS filters were evaluated. Results demonstrated that conventional packaging techniques could be used to successfully assemble stacked SAW on transceiver modules without damage. SAW compact models based on the coupling of modes model were developed to facilitate system design. Electromagnetic simulations of coupling between SAW filters and inductors integrated on the transceiver suggested that design care is needed to avoid interactions, especially if an IPD is not used as a spacer. With appropriate design, stacked SAW filter on transceiver offers viable module integration.</description><identifier>ISSN: 1521-3323</identifier><identifier>EISSN: 1557-9980</identifier><identifier>DOI: 10.1109/TADVP.2005.846935</identifier><identifier>CODEN: ITAPFZ</identifier><language>eng</language><publisher>Piscataway, NY: IEEE</publisher><subject>Acoustic wave devices, piezoelectric and piezoresistive devices ; Applied sciences ; Chips ; Circuit properties ; Costs ; Design engineering ; Design. Technologies. Operation analysis. Testing ; Electric, optical and optoelectronic circuits ; Electromagnetic coupling ; Electronic circuits ; Electronic components ; Electronics ; Electronics packaging ; Exact sciences and technology ; Frequency filters ; Integrated circuits ; Joining ; Land mobile radio cellular systems ; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits ; Mobile handsets ; Modules ; multichip modules ; Packaging ; Radio frequency ; SAW filters ; Semiconductor device packaging ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Semiconductors ; surface acoustic wave (SAW) filters ; Surface acoustic waves ; Transceivers</subject><ispartof>IEEE transactions on advanced packaging, 2005-05, Vol.28 (2), p.310-319</ispartof><rights>2005 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2005</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c416t-c18ff68cf36af769dd98b441c9e645649365425dff1f4c7d7c4d33514869244f3</citedby><cites>FETCH-LOGICAL-c416t-c18ff68cf36af769dd98b441c9e645649365425dff1f4c7d7c4d33514869244f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1427855$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1427855$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16770395$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Jones, R.E.</creatorcontrib><creatorcontrib>Ramiah, C.</creatorcontrib><creatorcontrib>Kamgaing, T.</creatorcontrib><creatorcontrib>Banerjee, S.K.</creatorcontrib><creatorcontrib>Chi-Taou Tsai</creatorcontrib><creatorcontrib>Hughes, H.G.</creatorcontrib><creatorcontrib>De Silva, A.P.</creatorcontrib><creatorcontrib>Drye, J.</creatorcontrib><creatorcontrib>Li Li</creatorcontrib><creatorcontrib>Blood, W.</creatorcontrib><creatorcontrib>Qiang Li</creatorcontrib><creatorcontrib>Vaughan, C.R.</creatorcontrib><creatorcontrib>Miglore, R.</creatorcontrib><creatorcontrib>Penunuri, D.</creatorcontrib><creatorcontrib>Lucero, R.</creatorcontrib><creatorcontrib>Frear, D.R.</creatorcontrib><creatorcontrib>Miller, M.F.</creatorcontrib><title>System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip</title><title>IEEE transactions on advanced packaging</title><addtitle>TADVP</addtitle><description>Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device (IPD) provided redistribution and matching between the SAW filter output and the transceiver input. Both extended global system for mobile communications (EGSM) and DCS filters were evaluated. Results demonstrated that conventional packaging techniques could be used to successfully assemble stacked SAW on transceiver modules without damage. SAW compact models based on the coupling of modes model were developed to facilitate system design. Electromagnetic simulations of coupling between SAW filters and inductors integrated on the transceiver suggested that design care is needed to avoid interactions, especially if an IPD is not used as a spacer. With appropriate design, stacked SAW filter on transceiver offers viable module integration.</description><subject>Acoustic wave devices, piezoelectric and piezoresistive devices</subject><subject>Applied sciences</subject><subject>Chips</subject><subject>Circuit properties</subject><subject>Costs</subject><subject>Design engineering</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electromagnetic coupling</subject><subject>Electronic circuits</subject><subject>Electronic components</subject><subject>Electronics</subject><subject>Electronics packaging</subject><subject>Exact sciences and technology</subject><subject>Frequency filters</subject><subject>Integrated circuits</subject><subject>Joining</subject><subject>Land mobile radio cellular systems</subject><subject>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</subject><subject>Mobile handsets</subject><subject>Modules</subject><subject>multichip modules</subject><subject>Packaging</subject><subject>Radio frequency</subject><subject>SAW filters</subject><subject>Semiconductor device packaging</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Semiconductors</subject><subject>surface acoustic wave (SAW) filters</subject><subject>Surface acoustic waves</subject><subject>Transceivers</subject><issn>1521-3323</issn><issn>1557-9980</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkV1LHTEQhpeiUL9-gHgTCtWrPc0kk2xyeTjVVhC0fvUypNlEY_fsniZ7RP99c3oEoRfi1Qy8zwzvzFtV-0AnAFR_uZ5-vb2YMErFRKHUXHyotkCIptZa0Y1Vz6DmnPGP1XbOD5QCKmRb1Y-r5zz6eR372tYL637bO09iP_q7ZMc49GQI5Gr6k1yekMsnEmI3-kTyWEDfkiJbMibbZ-fjYxHcfVzsVpvBdtnvvdSd6ubk-Hr2vT47_3Y6m57VDkGOtQMVglQucGlDI3XbavULEZz2EoVEzaVAJtoQIKBr2sZhy7kotqVmiIHvVEfrvYs0_Fn6PJp5LD66zvZ-WGajtATFFGIhD98kmZZKMPEOUAEAClrAT_-BD8My9eVcU-wBbQRCgWANuTTknHwwixTnNj0boGYVmvkXmlmFZtahlZnPL4ttdrYL5bcu5tdB2TSU6xV3sOai9_5VRtYoIfhfuyKdVA</recordid><startdate>20050501</startdate><enddate>20050501</enddate><creator>Jones, R.E.</creator><creator>Ramiah, C.</creator><creator>Kamgaing, T.</creator><creator>Banerjee, S.K.</creator><creator>Chi-Taou Tsai</creator><creator>Hughes, H.G.</creator><creator>De Silva, A.P.</creator><creator>Drye, J.</creator><creator>Li Li</creator><creator>Blood, W.</creator><creator>Qiang Li</creator><creator>Vaughan, C.R.</creator><creator>Miglore, R.</creator><creator>Penunuri, D.</creator><creator>Lucero, R.</creator><creator>Frear, D.R.</creator><creator>Miller, M.F.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>20050501</creationdate><title>System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip</title><author>Jones, R.E. ; Ramiah, C. ; Kamgaing, T. ; Banerjee, S.K. ; Chi-Taou Tsai ; Hughes, H.G. ; De Silva, A.P. ; Drye, J. ; Li Li ; Blood, W. ; Qiang Li ; Vaughan, C.R. ; Miglore, R. ; Penunuri, D. ; Lucero, R. ; Frear, D.R. ; Miller, M.F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c416t-c18ff68cf36af769dd98b441c9e645649365425dff1f4c7d7c4d33514869244f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Acoustic wave devices, piezoelectric and piezoresistive devices</topic><topic>Applied sciences</topic><topic>Chips</topic><topic>Circuit properties</topic><topic>Costs</topic><topic>Design engineering</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electromagnetic coupling</topic><topic>Electronic circuits</topic><topic>Electronic components</topic><topic>Electronics</topic><topic>Electronics packaging</topic><topic>Exact sciences and technology</topic><topic>Frequency filters</topic><topic>Integrated circuits</topic><topic>Joining</topic><topic>Land mobile radio cellular systems</topic><topic>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</topic><topic>Mobile handsets</topic><topic>Modules</topic><topic>multichip modules</topic><topic>Packaging</topic><topic>Radio frequency</topic><topic>SAW filters</topic><topic>Semiconductor device packaging</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Semiconductors</topic><topic>surface acoustic wave (SAW) filters</topic><topic>Surface acoustic waves</topic><topic>Transceivers</topic><toplevel>online_resources</toplevel><creatorcontrib>Jones, R.E.</creatorcontrib><creatorcontrib>Ramiah, C.</creatorcontrib><creatorcontrib>Kamgaing, T.</creatorcontrib><creatorcontrib>Banerjee, S.K.</creatorcontrib><creatorcontrib>Chi-Taou Tsai</creatorcontrib><creatorcontrib>Hughes, H.G.</creatorcontrib><creatorcontrib>De Silva, A.P.</creatorcontrib><creatorcontrib>Drye, J.</creatorcontrib><creatorcontrib>Li Li</creatorcontrib><creatorcontrib>Blood, W.</creatorcontrib><creatorcontrib>Qiang Li</creatorcontrib><creatorcontrib>Vaughan, C.R.</creatorcontrib><creatorcontrib>Miglore, R.</creatorcontrib><creatorcontrib>Penunuri, D.</creatorcontrib><creatorcontrib>Lucero, R.</creatorcontrib><creatorcontrib>Frear, D.R.</creatorcontrib><creatorcontrib>Miller, M.F.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jones, R.E.</au><au>Ramiah, C.</au><au>Kamgaing, T.</au><au>Banerjee, S.K.</au><au>Chi-Taou Tsai</au><au>Hughes, H.G.</au><au>De Silva, A.P.</au><au>Drye, J.</au><au>Li Li</au><au>Blood, W.</au><au>Qiang Li</au><au>Vaughan, C.R.</au><au>Miglore, R.</au><au>Penunuri, D.</au><au>Lucero, R.</au><au>Frear, D.R.</au><au>Miller, M.F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip</atitle><jtitle>IEEE transactions on advanced packaging</jtitle><stitle>TADVP</stitle><date>2005-05-01</date><risdate>2005</risdate><volume>28</volume><issue>2</issue><spage>310</spage><epage>319</epage><pages>310-319</pages><issn>1521-3323</issn><eissn>1557-9980</eissn><coden>ITAPFZ</coden><abstract>Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave (SAW) filters must be fabricated on piezoelectric substrates, and so they are difficult to monolithically integrate on semiconductor chips. This paper reports on a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device (IPD) provided redistribution and matching between the SAW filter output and the transceiver input. Both extended global system for mobile communications (EGSM) and DCS filters were evaluated. Results demonstrated that conventional packaging techniques could be used to successfully assemble stacked SAW on transceiver modules without damage. SAW compact models based on the coupling of modes model were developed to facilitate system design. Electromagnetic simulations of coupling between SAW filters and inductors integrated on the transceiver suggested that design care is needed to avoid interactions, especially if an IPD is not used as a spacer. With appropriate design, stacked SAW filter on transceiver offers viable module integration.</abstract><cop>Piscataway, NY</cop><pub>IEEE</pub><doi>10.1109/TADVP.2005.846935</doi><tpages>10</tpages></addata></record> |
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| subjects | Acoustic wave devices, piezoelectric and piezoresistive devices Applied sciences Chips Circuit properties Costs Design engineering Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electromagnetic coupling Electronic circuits Electronic components Electronics Electronics packaging Exact sciences and technology Frequency filters Integrated circuits Joining Land mobile radio cellular systems Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Mobile handsets Modules multichip modules Packaging Radio frequency SAW filters Semiconductor device packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors surface acoustic wave (SAW) filters Surface acoustic waves Transceivers |
| title | System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T10%3A58%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=System-in-a-package%20integration%20of%20SAW%20RF%20Rx%20filter%20stacked%20on%20a%20transceiver%20chip&rft.jtitle=IEEE%20transactions%20on%20advanced%20packaging&rft.au=Jones,%20R.E.&rft.date=2005-05-01&rft.volume=28&rft.issue=2&rft.spage=310&rft.epage=319&rft.pages=310-319&rft.issn=1521-3323&rft.eissn=1557-9980&rft.coden=ITAPFZ&rft_id=info:doi/10.1109/TADVP.2005.846935&rft_dat=%3Cproquest_RIE%3E896182844%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=869107541&rft_id=info:pmid/&rft_ieee_id=1427855&rfr_iscdi=true |