Synthesis and properties of fluorinated biphenyl-type epoxy resin

A novel fluorinated biphenyl-type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl-type phenolic resin, which was prepared by the condensation of 3-trifluoromethylphenol and 4,4'-bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixe...

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Veröffentlicht in:Journal of applied polymer science 2009-08, Vol.113 (3), p.1429-1437
Hauptverfasser: Ding, J.P, Tao, Z.Q, Fan, L, Yang, S.Y
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container_title Journal of applied polymer science
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creator Ding, J.P
Tao, Z.Q
Fan, L
Yang, S.Y
description A novel fluorinated biphenyl-type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl-type phenolic resin, which was prepared by the condensation of 3-trifluoromethylphenol and 4,4'-bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3-2.5 Pa s) at 120-122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409-415°C, high glass-transition temperature of 139-151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117-121 MPa as well as tensile strength of 71-72 MPa. The thermally cured fluorinated biphenyl-type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5-0.8 x 10¹⁷ Ω cm and surface resistivity of 0.8-4.6 x 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8-4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6-3.8 x 10⁻³. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame-retardant properties compared with the corresponding commercial biphenyl-type epoxy resins.
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Appl. Polym. Sci</addtitle><description>A novel fluorinated biphenyl-type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl-type phenolic resin, which was prepared by the condensation of 3-trifluoromethylphenol and 4,4'-bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3-2.5 Pa s) at 120-122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409-415°C, high glass-transition temperature of 139-151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117-121 MPa as well as tensile strength of 71-72 MPa. The thermally cured fluorinated biphenyl-type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5-0.8 x 10¹⁷ Ω cm and surface resistivity of 0.8-4.6 x 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8-4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6-3.8 x 10⁻³. 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Appl. Polym. Sci</addtitle><date>2009-08-05</date><risdate>2009</risdate><volume>113</volume><issue>3</issue><spage>1429</spage><epage>1437</epage><pages>1429-1437</pages><issn>0021-8995</issn><issn>1097-4628</issn><eissn>1097-4628</eissn><coden>JAPNAB</coden><abstract>A novel fluorinated biphenyl-type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl-type phenolic resin, which was prepared by the condensation of 3-trifluoromethylphenol and 4,4'-bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3-2.5 Pa s) at 120-122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409-415°C, high glass-transition temperature of 139-151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117-121 MPa as well as tensile strength of 71-72 MPa. The thermally cured fluorinated biphenyl-type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5-0.8 x 10¹⁷ Ω cm and surface resistivity of 0.8-4.6 x 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8-4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6-3.8 x 10⁻³. 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source Wiley Online Library Journals Frontfile Complete
subjects Applied sciences
Chemical properties
Condensation resins
Dielectric constant
Dielectric properties
epoxy
Epoxy resins
Exact sciences and technology
flame retardancy
Fluorination
Lewis acid
Phenolic resins
Polymer blends
Polymer industry, paints, wood
Properties and testing
Reproduction
Technology of polymers
water absorption
Weight loss
title Synthesis and properties of fluorinated biphenyl-type epoxy resin
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