Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

► Conformal electroless barrier and seed layers were formed in high aspect ratio TSV. ► Au nanoparticles of 20 nm diameter were used as a catalyst. ► Adhesion strength of the diffusion barrier films are enhanced with annealing at 300 °C. ► This technology enables all-wet fabrication of Cu-filled TSV...

Ausführliche Beschreibung