PCB-Integrated Heat Exchanger for Cooling Electronics Using Microchannels Fabricated With the Direct-Write Method
The electronic industry has a growing need for efficient heat dissipation mechanisms such as micro heat exchanger systems. This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2008-12, Vol.31 (4), p.869-874 |
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| container_title | IEEE transactions on components and packaging technologies |
| container_volume | 31 |
| creator | Oueslati, R.B. Therriault, D. Martel, S. |
| description | The electronic industry has a growing need for efficient heat dissipation mechanisms such as micro heat exchanger systems. This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro-cooling configurations, their commercial utilization by the electronic industry is rather limited due to complex fabrication and integration methods. Here, we present the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application. The thermal performance of the manufactured prototype was characterized with respect to the fluid flow rate. The original fabrication and integration approaches presented here show high potential for efficient, compact, and low-cost micro heat exchangers for the electronic industry. |
| doi_str_mv | 10.1109/TCAPT.2008.2004773 |
| format | Article |
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This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro-cooling configurations, their commercial utilization by the electronic industry is rather limited due to complex fabrication and integration methods. Here, we present the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application. The thermal performance of the manufactured prototype was characterized with respect to the fluid flow rate. 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This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro-cooling configurations, their commercial utilization by the electronic industry is rather limited due to complex fabrication and integration methods. Here, we present the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application. The thermal performance of the manufactured prototype was characterized with respect to the fluid flow rate. The original fabrication and integration approaches presented here show high potential for efficient, compact, and low-cost micro heat exchangers for the electronic industry.</description><subject>Assembly</subject><subject>Cooling</subject><subject>Direct-write assembly</subject><subject>electronic cooling</subject><subject>Electronics</subject><subject>Electronics cooling</subject><subject>Electronics industry</subject><subject>Fabrication</subject><subject>Fluid dynamics</subject><subject>Fluid flow</subject><subject>Heat exchangers</subject><subject>Manufacturing</subject><subject>micro heat exchanger</subject><subject>Microchannel</subject><subject>Microchannels</subject><subject>Microfluidics</subject><subject>printed circuit board (PCB)</subject><subject>Printed circuits</subject><subject>Prototypes</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kT9v2zAQxYWgBZq6-QLNQnRIJ7n8I5HimKp2E8BBMtjwSEjk0WagiAlJA-m3L2UHHTJ0uTscfu-Ae68ovhI8JwTLH-v2-mE9pxg3U6mEYGfFOalrUUop6IdppqRkjJFPxecYHzEmVVPJ8-Llof1Z3o4JdqFLYNANdAktXvW-G3cQkPUBtd4PbtyhxQA6BT86HdEmTps7p4Of0BGGiJZdH5w-Xtm6tEdpD-iXC1lUboNLgO4g7b35Uny03RDh4q3Pis1ysW5vytX979v2elVqVotUGmq0tcRWEvfArTZNTXsjLAXJpa4w6N5yQamooK8oBy0xNoZJzA2vTUfYrPh-uvsc_MsBYlJPLmoYhm4Ef4iqEXU2iuE6k1f_JRln2SyOM_jtHfjoD2HMX6iGs-wpYzJD9ARlb2IMYNVzcE9d-KMIVlNY6hiWmsJSb2Fl0eVJ5ADgn6DiouYCs78SIpET</recordid><startdate>20081201</startdate><enddate>20081201</enddate><creator>Oueslati, R.B.</creator><creator>Therriault, D.</creator><creator>Martel, S.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| identifier | ISSN: 1521-3331 |
| ispartof | IEEE transactions on components and packaging technologies, 2008-12, Vol.31 (4), p.869-874 |
| issn | 1521-3331 1557-9972 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Assembly Cooling Direct-write assembly electronic cooling Electronics Electronics cooling Electronics industry Fabrication Fluid dynamics Fluid flow Heat exchangers Manufacturing micro heat exchanger Microchannel Microchannels Microfluidics printed circuit board (PCB) Printed circuits Prototypes |
| title | PCB-Integrated Heat Exchanger for Cooling Electronics Using Microchannels Fabricated With the Direct-Write Method |
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