Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad
This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and...
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| Veröffentlicht in: | IEEE transactions on electronics packaging manufacturing 2010-01, Vol.33 (1), p.65-70 |
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| container_title | IEEE transactions on electronics packaging manufacturing |
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| creator | JENG, Yeau-Ren CHIU, Sang-Mao HUANG, Pay-Yau SHYU, Shiuh-Hwa |
| description | This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance. |
| doi_str_mv | 10.1109/TEPM.2009.2034467 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_875043761</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5371827</ieee_id><sourcerecordid>875043761</sourcerecordid><originalsourceid>FETCH-LOGICAL-c386t-b770dd0ebaedc41dd341f6616f9d2f8ad80d72a68df5b4901f5d185ee6b4b00f3</originalsourceid><addsrcrecordid>eNqFkU1rGzEQhpfQQN00P6DkshRKT5vqW9pjaxIn4JIPHJKb0K5GqcJacqV1IP8-Wmx86KWXmYH3mWFm3qr6gtE5xqj9sbq4_X1OEGpLoIwJeVTNMOeqQYqQD1NNcEMpe_pYfcr5BSHMOCGz6u46vEIe_bMZfQx1dPXqD6R1zDH4vn70CepfMVgfnut7yD6PJvQwYYs42J1-E8ZYz-NmA6m-NfZzdezMkOF0n0-qh8uL1fyqWd4sruc_l01PlRibTkpkLYLOgO0ZtpYy7ITAwrWWOGWsQlYSI5R1vGMtwo5brDiA6FiHkKMn1ffd3E2Kf7flBr32uYdhMAHiNmslOWJUCvxfUnIqCSOqLeTXf8iXuE2hnKEVF4zy8s0C4R3Up5hzAqc3ya9NetMY6ckMPZmhJzP03ozS820_2OTeDC6VN_p8aCSEtVgpXrizHecB4CCX_bAikr4Dq8uR4A</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>856435082</pqid></control><display><type>article</type><title>Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad</title><source>IEEE Electronic Library (IEL)</source><creator>JENG, Yeau-Ren ; CHIU, Sang-Mao ; HUANG, Pay-Yau ; SHYU, Shiuh-Hwa</creator><creatorcontrib>JENG, Yeau-Ren ; CHIU, Sang-Mao ; HUANG, Pay-Yau ; SHYU, Shiuh-Hwa</creatorcontrib><description>This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance.</description><identifier>ISSN: 1521-334X</identifier><identifier>EISSN: 1558-0822</identifier><identifier>DOI: 10.1109/TEPM.2009.2034467</identifier><identifier>CODEN: ITEPFL</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Argon ; BONDING ; Chips with copper interconnects ; Circuits ; COATINGS ; Contact ; CONTACT RESISTANCE ; Copper ; CUPRIC OXIDE ; CUPROUS OXIDE ; Design. Technologies. Operation analysis. Testing ; Electric resistance ; Electric wire ; Electronics ; Exact sciences and technology ; Gold ; Integrated circuits ; micro-contact theory ; OXIDE COATINGS ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Silver ; Thermal resistance ; thermosonic bonding ; WIRE</subject><ispartof>IEEE transactions on electronics packaging manufacturing, 2010-01, Vol.33 (1), p.65-70</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jan 2010</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c386t-b770dd0ebaedc41dd341f6616f9d2f8ad80d72a68df5b4901f5d185ee6b4b00f3</citedby><cites>FETCH-LOGICAL-c386t-b770dd0ebaedc41dd341f6616f9d2f8ad80d72a68df5b4901f5d185ee6b4b00f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5371827$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,4010,27900,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5371827$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22491885$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>JENG, Yeau-Ren</creatorcontrib><creatorcontrib>CHIU, Sang-Mao</creatorcontrib><creatorcontrib>HUANG, Pay-Yau</creatorcontrib><creatorcontrib>SHYU, Shiuh-Hwa</creatorcontrib><title>Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad</title><title>IEEE transactions on electronics packaging manufacturing</title><addtitle>TEPM</addtitle><description>This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance.</description><subject>Applied sciences</subject><subject>Argon</subject><subject>BONDING</subject><subject>Chips with copper interconnects</subject><subject>Circuits</subject><subject>COATINGS</subject><subject>Contact</subject><subject>CONTACT RESISTANCE</subject><subject>Copper</subject><subject>CUPRIC OXIDE</subject><subject>CUPROUS OXIDE</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric resistance</subject><subject>Electric wire</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Gold</subject><subject>Integrated circuits</subject><subject>micro-contact theory</subject><subject>OXIDE COATINGS</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Silver</subject><subject>Thermal resistance</subject><subject>thermosonic bonding</subject><subject>WIRE</subject><issn>1521-334X</issn><issn>1558-0822</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkU1rGzEQhpfQQN00P6DkshRKT5vqW9pjaxIn4JIPHJKb0K5GqcJacqV1IP8-Wmx86KWXmYH3mWFm3qr6gtE5xqj9sbq4_X1OEGpLoIwJeVTNMOeqQYqQD1NNcEMpe_pYfcr5BSHMOCGz6u46vEIe_bMZfQx1dPXqD6R1zDH4vn70CepfMVgfnut7yD6PJvQwYYs42J1-E8ZYz-NmA6m-NfZzdezMkOF0n0-qh8uL1fyqWd4sruc_l01PlRibTkpkLYLOgO0ZtpYy7ITAwrWWOGWsQlYSI5R1vGMtwo5brDiA6FiHkKMn1ffd3E2Kf7flBr32uYdhMAHiNmslOWJUCvxfUnIqCSOqLeTXf8iXuE2hnKEVF4zy8s0C4R3Up5hzAqc3ya9NetMY6ckMPZmhJzP03ozS820_2OTeDC6VN_p8aCSEtVgpXrizHecB4CCX_bAikr4Dq8uR4A</recordid><startdate>201001</startdate><enddate>201001</enddate><creator>JENG, Yeau-Ren</creator><creator>CHIU, Sang-Mao</creator><creator>HUANG, Pay-Yau</creator><creator>SHYU, Shiuh-Hwa</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>201001</creationdate><title>Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad</title><author>JENG, Yeau-Ren ; CHIU, Sang-Mao ; HUANG, Pay-Yau ; SHYU, Shiuh-Hwa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c386t-b770dd0ebaedc41dd341f6616f9d2f8ad80d72a68df5b4901f5d185ee6b4b00f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Applied sciences</topic><topic>Argon</topic><topic>BONDING</topic><topic>Chips with copper interconnects</topic><topic>Circuits</topic><topic>COATINGS</topic><topic>Contact</topic><topic>CONTACT RESISTANCE</topic><topic>Copper</topic><topic>CUPRIC OXIDE</topic><topic>CUPROUS OXIDE</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric resistance</topic><topic>Electric wire</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Gold</topic><topic>Integrated circuits</topic><topic>micro-contact theory</topic><topic>OXIDE COATINGS</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Silver</topic><topic>Thermal resistance</topic><topic>thermosonic bonding</topic><topic>WIRE</topic><toplevel>online_resources</toplevel><creatorcontrib>JENG, Yeau-Ren</creatorcontrib><creatorcontrib>CHIU, Sang-Mao</creatorcontrib><creatorcontrib>HUANG, Pay-Yau</creatorcontrib><creatorcontrib>SHYU, Shiuh-Hwa</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JENG, Yeau-Ren</au><au>CHIU, Sang-Mao</au><au>HUANG, Pay-Yau</au><au>SHYU, Shiuh-Hwa</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad</atitle><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle><stitle>TEPM</stitle><date>2010-01</date><risdate>2010</risdate><volume>33</volume><issue>1</issue><spage>65</spage><epage>70</epage><pages>65-70</pages><issn>1521-334X</issn><eissn>1558-0822</eissn><coden>ITEPFL</coden><abstract>This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TEPM.2009.2034467</doi><tpages>6</tpages></addata></record> |
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| ispartof | IEEE transactions on electronics packaging manufacturing, 2010-01, Vol.33 (1), p.65-70 |
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| subjects | Applied sciences Argon BONDING Chips with copper interconnects Circuits COATINGS Contact CONTACT RESISTANCE Copper CUPRIC OXIDE CUPROUS OXIDE Design. Technologies. Operation analysis. Testing Electric resistance Electric wire Electronics Exact sciences and technology Gold Integrated circuits micro-contact theory OXIDE COATINGS Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silver Thermal resistance thermosonic bonding WIRE |
| title | Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T05%3A48%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Investigation%20of%20Thermosonic%20Wire%20Bonding%20Resistance%20of%20Gold%20Wire%20Onto%20Copper%20Pad&rft.jtitle=IEEE%20transactions%20on%20electronics%20packaging%20manufacturing&rft.au=JENG,%20Yeau-Ren&rft.date=2010-01&rft.volume=33&rft.issue=1&rft.spage=65&rft.epage=70&rft.pages=65-70&rft.issn=1521-334X&rft.eissn=1558-0822&rft.coden=ITEPFL&rft_id=info:doi/10.1109/TEPM.2009.2034467&rft_dat=%3Cproquest_RIE%3E875043761%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=856435082&rft_id=info:pmid/&rft_ieee_id=5371827&rfr_iscdi=true |