Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies

3-D stacking and integration can provide system advantages. This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. This paper presents physic...

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Veröffentlicht in:	IEEE transactions on very large scale integration (VLSI) systems 2009-04, Vol.17 (4), p.496-506
Hauptverfasser:	Davis, W.R., Oh, E.C., Sule, A.M., Franzon, P.D.
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integrated circuit (IC) Application software Computer aided design Costs Delay Design automation Drivers Equivalence Fast Fourier transform (FFT) first-in first-out (FIFO) Fourier transforms Integrated circuit interconnections Integrated circuit technology Integrated circuits Packaging Reduction Stacking ternary content-addressable memory (TCAM) Three-dimensional integrated circuits Through-silicon vias Very large scale integration
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