Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies
3-D stacking and integration can provide system advantages. This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. This paper presents physic...
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| Veröffentlicht in: | IEEE transactions on very large scale integration (VLSI) systems 2009-04, Vol.17 (4), p.496-506 |
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| container_title | IEEE transactions on very large scale integration (VLSI) systems |
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| creator | Davis, W.R. Oh, E.C. Sule, A.M. Franzon, P.D. |
| description | 3-D stacking and integration can provide system advantages. This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. This paper presents physical-design case studies of ternary content-addressable memories (TCAMs), first-in first-out (FIFO) memories, and a 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180-nm 3-D process. The TCAM shows a 23% power reduction and the FFT shows a 22% reduction in cycle-time, coupled with an 18% reduction in energy per transform. |
| doi_str_mv | 10.1109/TVLSI.2008.2009352 |
| format | Article |
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This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. This paper presents physical-design case studies of ternary content-addressable memories (TCAMs), first-in first-out (FIFO) memories, and a 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180-nm 3-D process. 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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | 3-D integrated circuit (IC) Application software Computer aided design Costs Delay Design automation Drivers Equivalence Fast Fourier transform (FFT) first-in first-out (FIFO) Fourier transforms Integrated circuit interconnections Integrated circuit technology Integrated circuits Packaging Reduction Stacking ternary content-addressable memory (TCAM) Three-dimensional integrated circuits Through-silicon vias Very large scale integration |
| title | Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies |
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