Extracting thin film hardness of extremely compliant films on stiff substrates

A previously reported method for extracting the thin film hardness from nanoindentation into a film on an elastically mismatched substrate was applied to four different cases of extreme mismatch in elastic properties: Parmax, Ultem, Polysulfone and Perfluorocyclobutyl polymer thin films on Si substr...

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Veröffentlicht in:	Thin solid films 2011-03, Vol.519 (10), p.3221-3224
Hauptverfasser:	Han, Seung Min, Guyer, Eric P., Nix, William D.
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Contact Exact sciences and technology Hardness Indentation Mechanical and acoustical properties Nanoindentation Physical properties of thin films, nonelectronic Physics Polymer Polymeric films Shear modulus Silicon substrates Structure and morphology thickness Substrate effects Surface roughness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film Thin film structure and morphology Thin films
Online-Zugang:	Volltext
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