The Evaluation Technologies of Materials Such as Polymers Used in a Semiconductor BEOL Process
An introduction of new materials has been the important breakthrough in each technology node. For the rapid development of novel materials, material suppliers have founded Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT) in 2003. CASMAT provides whole equipment for p...
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| Veröffentlicht in: | Journal of Photopolymer Science and Technology 2010/06/22, Vol.23(4), pp.489-494 |
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| container_end_page | 494 |
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| container_issue | 4 |
| container_start_page | 489 |
| container_title | Journal of Photopolymer Science and Technology |
| container_volume | 23 |
| creator | Kawamoto, Yoshifumi |
| description | An introduction of new materials has been the important breakthrough in each technology node. For the rapid development of novel materials, material suppliers have founded Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT) in 2003. CASMAT provides whole equipment for process of Back-end- Of-Line (BEOL), and applies new materials to 300mm silicon wafers. CASMAT evaluates, and reveals important characteristics of those materials, points out issues, also offers efficient solutions to material suppliers. As a result, they can shorten the research and development period of materials, and expand their business because of bringing new products to the market rapidly. As the examples, Test Element Group (TEG) masks and wafers, a quantitative evaluation method of adhesion strength, and an integrated solution for wiring with a polymer low-k material are presented here. |
| doi_str_mv | 10.2494/photopolymer.23.489 |
| format | Article |
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| ispartof | Journal of Photopolymer Science and Technology, 2010/06/22, Vol.23(4), pp.489-494 |
| issn | 0914-9244 1349-6336 1349-6336 |
| language | eng |
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| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; EZB-FREE-00999 freely available EZB journals; Free Full-Text Journals in Chemistry |
| subjects | adhesion strength Adhesion tests Adhesive strength Back-End-Of-Line buffer-coat material Business Consortium for Advanced Semiconductor Materials and Related Technologies low-k material Polymers semiconductor material Semiconductor materials Semiconductors Silicon Suppliers Test Element Group Wafers |
| title | The Evaluation Technologies of Materials Such as Polymers Used in a Semiconductor BEOL Process |
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