Metal-assisted etching of p-silicon—Pore formation and characterization
▶ The paper represents a part of active research in the field of materials science. ▶ It specifies the proper conditions to obtain porous silicon layers on Si in the nano structure range for solar energy conversion and optoelectronic applications. Etching of silicon and formation of definite porous...
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Veröffentlicht in: | Journal of alloys and compounds 2011-03, Vol.509 (10), p.4122-4126 |
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creator | El-Sherif, Rabab M. Khalil, Shaaban A. Badawy, Waheed. A. |
description | ▶ The paper represents a part of active research in the field of materials science. ▶ It specifies the proper conditions to obtain porous silicon layers on Si in the nano structure range for solar energy conversion and optoelectronic applications.
Etching of silicon and formation of definite porous surfaces can be carried out by different methods. Metal-assisted etching represents a convenient method for the application of induced etching for beneficial applications. Porous silicon layers (PSL) on Si are useful and important in solar energy conversion and optoelectronics. Porous silicon on silicon increases the effective area and thus higher optical absorption as well as solar conversion efficiency can be achieved. The effective optical properties of PSL have found great interest in optoelectronics. In the last few years PSL of definite pore structures have been prepared by metal-assisted etching of p-Si in aqueous hydrofluoric acid solutions containing different oxidizing agents. Potassium dichromate, at definite concentration and after optimum etching time of p-Si on which Pt nuclei were electroless deposited, has shown promising effects. The effect of etching time, K
2Cr
2O
7 concentration and HF concentration on the main characteristics of the porous structure was investigated and discussed. In this respect electrochemical impedance spectroscopy (EIS) was used. The experimental data were fitted to theoretical data according to a proposed electrical equivalent circuit model. The morphology of the formed layers and surface contaminations were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) techniques.
The results have shown that PSL with nano and micro pores were formed on p-Si when etched in HF–K
2Cr
2O
7 aqueous solutions. At 22.0
mol
L
−1 HF and relatively high concentration of K
2Cr
2O
7 [>0.05
mol
L
−1] a passive K
2SiF
6 layer was formed on the Si surface with a thickness that is affected by the concentrations of both HF and K
2Cr
2O
7. The passive K
2SiF
6 layer reduces the effectiveness of the PSL in both the solar conversion process and also its electrical and optical characteristics. |
doi_str_mv | 10.1016/j.jallcom.2010.12.175 |
format | Article |
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Etching of silicon and formation of definite porous surfaces can be carried out by different methods. Metal-assisted etching represents a convenient method for the application of induced etching for beneficial applications. Porous silicon layers (PSL) on Si are useful and important in solar energy conversion and optoelectronics. Porous silicon on silicon increases the effective area and thus higher optical absorption as well as solar conversion efficiency can be achieved. The effective optical properties of PSL have found great interest in optoelectronics. In the last few years PSL of definite pore structures have been prepared by metal-assisted etching of p-Si in aqueous hydrofluoric acid solutions containing different oxidizing agents. Potassium dichromate, at definite concentration and after optimum etching time of p-Si on which Pt nuclei were electroless deposited, has shown promising effects. The effect of etching time, K
2Cr
2O
7 concentration and HF concentration on the main characteristics of the porous structure was investigated and discussed. In this respect electrochemical impedance spectroscopy (EIS) was used. The experimental data were fitted to theoretical data according to a proposed electrical equivalent circuit model. The morphology of the formed layers and surface contaminations were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) techniques.
The results have shown that PSL with nano and micro pores were formed on p-Si when etched in HF–K
2Cr
2O
7 aqueous solutions. At 22.0
mol
L
−1 HF and relatively high concentration of K
2Cr
2O
7 [>0.05
mol
L
−1] a passive K
2SiF
6 layer was formed on the Si surface with a thickness that is affected by the concentrations of both HF and K
2Cr
2O
7. The passive K
2SiF
6 layer reduces the effectiveness of the PSL in both the solar conversion process and also its electrical and optical characteristics.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2010.12.175</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Chemistry ; Colloidal state and disperse state ; Electrochemical impedance spectroscopy ; Etching ; Exact sciences and technology ; General and physical chemistry ; Impedance ; Mathematical models ; Metal-assisted etching ; Nanostructure ; Optoelectronics ; Porous materials ; Porous silicon ; Potassium dichromate ; Scanning electron microscopy ; Silicon ; X-ray dispersive spectroscopy</subject><ispartof>Journal of alloys and compounds, 2011-03, Vol.509 (10), p.4122-4126</ispartof><rights>2011 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c412t-fe0c842644551f7cc3860b99e56dd92d8fa57b963128683ec9132d9e3d2ba0fd3</citedby><cites>FETCH-LOGICAL-c412t-fe0c842644551f7cc3860b99e56dd92d8fa57b963128683ec9132d9e3d2ba0fd3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2010.12.175$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23908550$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>El-Sherif, Rabab M.</creatorcontrib><creatorcontrib>Khalil, Shaaban A.</creatorcontrib><creatorcontrib>Badawy, Waheed. A.</creatorcontrib><title>Metal-assisted etching of p-silicon—Pore formation and characterization</title><title>Journal of alloys and compounds</title><description>▶ The paper represents a part of active research in the field of materials science. ▶ It specifies the proper conditions to obtain porous silicon layers on Si in the nano structure range for solar energy conversion and optoelectronic applications.
Etching of silicon and formation of definite porous surfaces can be carried out by different methods. Metal-assisted etching represents a convenient method for the application of induced etching for beneficial applications. Porous silicon layers (PSL) on Si are useful and important in solar energy conversion and optoelectronics. Porous silicon on silicon increases the effective area and thus higher optical absorption as well as solar conversion efficiency can be achieved. The effective optical properties of PSL have found great interest in optoelectronics. In the last few years PSL of definite pore structures have been prepared by metal-assisted etching of p-Si in aqueous hydrofluoric acid solutions containing different oxidizing agents. Potassium dichromate, at definite concentration and after optimum etching time of p-Si on which Pt nuclei were electroless deposited, has shown promising effects. The effect of etching time, K
2Cr
2O
7 concentration and HF concentration on the main characteristics of the porous structure was investigated and discussed. In this respect electrochemical impedance spectroscopy (EIS) was used. The experimental data were fitted to theoretical data according to a proposed electrical equivalent circuit model. The morphology of the formed layers and surface contaminations were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) techniques.
The results have shown that PSL with nano and micro pores were formed on p-Si when etched in HF–K
2Cr
2O
7 aqueous solutions. At 22.0
mol
L
−1 HF and relatively high concentration of K
2Cr
2O
7 [>0.05
mol
L
−1] a passive K
2SiF
6 layer was formed on the Si surface with a thickness that is affected by the concentrations of both HF and K
2Cr
2O
7. The passive K
2SiF
6 layer reduces the effectiveness of the PSL in both the solar conversion process and also its electrical and optical characteristics.</description><subject>Chemistry</subject><subject>Colloidal state and disperse state</subject><subject>Electrochemical impedance spectroscopy</subject><subject>Etching</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Impedance</subject><subject>Mathematical models</subject><subject>Metal-assisted etching</subject><subject>Nanostructure</subject><subject>Optoelectronics</subject><subject>Porous materials</subject><subject>Porous silicon</subject><subject>Potassium dichromate</subject><subject>Scanning electron microscopy</subject><subject>Silicon</subject><subject>X-ray dispersive spectroscopy</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNqFkMtKAzEUhoMoWC-PIMxGXE3NZTJNViLFG1R0oeuQnpzYlOmkJlNBVz6ET-iTOLXFrasDP_-F8xFywuiQUVafz4dz2zQQF0NO1xofspHcIQOmRqKs6lrvkgHVXJZKKLVPDnKeU0qZFmxA7u6xs01pcw65Q1dgB7PQvhTRF8syhyZAbL8_vx5jwsLHtLBdiG1hW1fAzCYLHabw8SsekT1vm4zH23tInq-vnsa35eTh5m58OSmhYrwrPVJQFa-rSkrmRwBC1XSqNcraOc2d8laOproWjKtaCQTNBHcaheNTS70Th-Rs07tM8XWFuTOLkAGbxrYYV9movporUfHeKTdOSDHnhN4sU1jY9G4YNWtyZm625MyanGHc9OT63Ol2wWawjU-2hZD_wlxoqqSkve9i48P-3beAyWQI2AK6kBA642L4Z-kHvfKIEA</recordid><startdate>20110310</startdate><enddate>20110310</enddate><creator>El-Sherif, Rabab M.</creator><creator>Khalil, Shaaban A.</creator><creator>Badawy, Waheed. A.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20110310</creationdate><title>Metal-assisted etching of p-silicon—Pore formation and characterization</title><author>El-Sherif, Rabab M. ; Khalil, Shaaban A. ; Badawy, Waheed. A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c412t-fe0c842644551f7cc3860b99e56dd92d8fa57b963128683ec9132d9e3d2ba0fd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Chemistry</topic><topic>Colloidal state and disperse state</topic><topic>Electrochemical impedance spectroscopy</topic><topic>Etching</topic><topic>Exact sciences and technology</topic><topic>General and physical chemistry</topic><topic>Impedance</topic><topic>Mathematical models</topic><topic>Metal-assisted etching</topic><topic>Nanostructure</topic><topic>Optoelectronics</topic><topic>Porous materials</topic><topic>Porous silicon</topic><topic>Potassium dichromate</topic><topic>Scanning electron microscopy</topic><topic>Silicon</topic><topic>X-ray dispersive spectroscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>El-Sherif, Rabab M.</creatorcontrib><creatorcontrib>Khalil, Shaaban A.</creatorcontrib><creatorcontrib>Badawy, Waheed. A.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>El-Sherif, Rabab M.</au><au>Khalil, Shaaban A.</au><au>Badawy, Waheed. A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Metal-assisted etching of p-silicon—Pore formation and characterization</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2011-03-10</date><risdate>2011</risdate><volume>509</volume><issue>10</issue><spage>4122</spage><epage>4126</epage><pages>4122-4126</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>▶ The paper represents a part of active research in the field of materials science. ▶ It specifies the proper conditions to obtain porous silicon layers on Si in the nano structure range for solar energy conversion and optoelectronic applications.
Etching of silicon and formation of definite porous surfaces can be carried out by different methods. Metal-assisted etching represents a convenient method for the application of induced etching for beneficial applications. Porous silicon layers (PSL) on Si are useful and important in solar energy conversion and optoelectronics. Porous silicon on silicon increases the effective area and thus higher optical absorption as well as solar conversion efficiency can be achieved. The effective optical properties of PSL have found great interest in optoelectronics. In the last few years PSL of definite pore structures have been prepared by metal-assisted etching of p-Si in aqueous hydrofluoric acid solutions containing different oxidizing agents. Potassium dichromate, at definite concentration and after optimum etching time of p-Si on which Pt nuclei were electroless deposited, has shown promising effects. The effect of etching time, K
2Cr
2O
7 concentration and HF concentration on the main characteristics of the porous structure was investigated and discussed. In this respect electrochemical impedance spectroscopy (EIS) was used. The experimental data were fitted to theoretical data according to a proposed electrical equivalent circuit model. The morphology of the formed layers and surface contaminations were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) techniques.
The results have shown that PSL with nano and micro pores were formed on p-Si when etched in HF–K
2Cr
2O
7 aqueous solutions. At 22.0
mol
L
−1 HF and relatively high concentration of K
2Cr
2O
7 [>0.05
mol
L
−1] a passive K
2SiF
6 layer was formed on the Si surface with a thickness that is affected by the concentrations of both HF and K
2Cr
2O
7. The passive K
2SiF
6 layer reduces the effectiveness of the PSL in both the solar conversion process and also its electrical and optical characteristics.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2010.12.175</doi><tpages>5</tpages></addata></record> |
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source | Elsevier ScienceDirect Journals Complete |
subjects | Chemistry Colloidal state and disperse state Electrochemical impedance spectroscopy Etching Exact sciences and technology General and physical chemistry Impedance Mathematical models Metal-assisted etching Nanostructure Optoelectronics Porous materials Porous silicon Potassium dichromate Scanning electron microscopy Silicon X-ray dispersive spectroscopy |
title | Metal-assisted etching of p-silicon—Pore formation and characterization |
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