Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath
This paper is aimed on studying film smoothening effect of supercritical carbon dioxide emulsion (Sc-CO 2-E) on nickel film electroplated using an additive-free Watts bath. Morphology of nickel film electroplated with Sc-CO 2-E was found to be similar to that of nickel film prepared from electroless...
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Veröffentlicht in: | Electrochimica acta 2010-09, Vol.55 (22), p.6469-6475 |
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creator | Chang, Tso-Fu Mark Sone, Masato Shibata, Akinobu Ishiyama, Chiemi Higo, Yakichi |
description | This paper is aimed on studying film smoothening effect of supercritical carbon dioxide emulsion (Sc-CO
2-E) on nickel film electroplated using an additive-free Watts bath. Morphology of nickel film electroplated with Sc-CO
2-E was found to be similar to that of nickel film prepared from electroless plating. Surface roughness (
R
a) of nickel film electroplated with Sc-CO
2-E was lower than that of nickel film electroplated through conventional method. A minimum
R
a was found for nickel film electroplated through conventional method and Sc-CO
2-E when increasing current density from 0.010 to 0.150
A/cm
2. The minimum
R
a was 69.8
nm at 0.020
A/cm
2 and 14.0
nm at 0.030
A/cm
2, respectively for conventional and Sc-CO
2-E case. After the minimum point, increasing rate of
R
a increased was lower for Sc-CO
2-E case; this was because of higher hydrogen solubility in Sc-CO
2. Grain size of nickel film electroplated with Sc-CO
2-E was found to be finer than that of conventional case. |
doi_str_mv | 10.1016/j.electacta.2010.06.037 |
format | Article |
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2-E) on nickel film electroplated using an additive-free Watts bath. Morphology of nickel film electroplated with Sc-CO
2-E was found to be similar to that of nickel film prepared from electroless plating. Surface roughness (
R
a) of nickel film electroplated with Sc-CO
2-E was lower than that of nickel film electroplated through conventional method. A minimum
R
a was found for nickel film electroplated through conventional method and Sc-CO
2-E when increasing current density from 0.010 to 0.150
A/cm
2. The minimum
R
a was 69.8
nm at 0.020
A/cm
2 and 14.0
nm at 0.030
A/cm
2, respectively for conventional and Sc-CO
2-E case. After the minimum point, increasing rate of
R
a increased was lower for Sc-CO
2-E case; this was because of higher hydrogen solubility in Sc-CO
2. Grain size of nickel film electroplated with Sc-CO
2-E was found to be finer than that of conventional case.</description><identifier>ISSN: 0013-4686</identifier><identifier>EISSN: 1873-3859</identifier><identifier>DOI: 10.1016/j.electacta.2010.06.037</identifier><identifier>CODEN: ELCAAV</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Additive-free Watts bath ; Additives ; Baths ; Bright film ; Carbon dioxide ; Chemistry ; Deposition ; Electrochemistry ; Electrodeposition ; Electroless plating ; Emulsions ; Exact sciences and technology ; General and physical chemistry ; Grain size ; Nickel ; Nickel electroplating ; Study of interfaces ; Supercritical carbon dioxide emulsion</subject><ispartof>Electrochimica acta, 2010-09, Vol.55 (22), p.6469-6475</ispartof><rights>2010 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c443t-151fcb38a76ff07f48cc4e687552d3b77a83b1fb15e5d3b2551dd06aeba8cb093</citedby><cites>FETCH-LOGICAL-c443t-151fcb38a76ff07f48cc4e687552d3b77a83b1fb15e5d3b2551dd06aeba8cb093</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.electacta.2010.06.037$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23175284$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chang, Tso-Fu Mark</creatorcontrib><creatorcontrib>Sone, Masato</creatorcontrib><creatorcontrib>Shibata, Akinobu</creatorcontrib><creatorcontrib>Ishiyama, Chiemi</creatorcontrib><creatorcontrib>Higo, Yakichi</creatorcontrib><title>Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath</title><title>Electrochimica acta</title><description>This paper is aimed on studying film smoothening effect of supercritical carbon dioxide emulsion (Sc-CO
2-E) on nickel film electroplated using an additive-free Watts bath. Morphology of nickel film electroplated with Sc-CO
2-E was found to be similar to that of nickel film prepared from electroless plating. Surface roughness (
R
a) of nickel film electroplated with Sc-CO
2-E was lower than that of nickel film electroplated through conventional method. A minimum
R
a was found for nickel film electroplated through conventional method and Sc-CO
2-E when increasing current density from 0.010 to 0.150
A/cm
2. The minimum
R
a was 69.8
nm at 0.020
A/cm
2 and 14.0
nm at 0.030
A/cm
2, respectively for conventional and Sc-CO
2-E case. After the minimum point, increasing rate of
R
a increased was lower for Sc-CO
2-E case; this was because of higher hydrogen solubility in Sc-CO
2. Grain size of nickel film electroplated with Sc-CO
2-E was found to be finer than that of conventional case.</description><subject>Additive-free Watts bath</subject><subject>Additives</subject><subject>Baths</subject><subject>Bright film</subject><subject>Carbon dioxide</subject><subject>Chemistry</subject><subject>Deposition</subject><subject>Electrochemistry</subject><subject>Electrodeposition</subject><subject>Electroless plating</subject><subject>Emulsions</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Grain size</subject><subject>Nickel</subject><subject>Nickel electroplating</subject><subject>Study of interfaces</subject><subject>Supercritical carbon dioxide emulsion</subject><issn>0013-4686</issn><issn>1873-3859</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNqFkEtrHDEMgE1pods0vyG-lJ5mK4-fOaahTQqBXFp6NH7IibezM1vbE5p_X4cNuQYEQuKThD5CzhhsGTD1ZbfFCUNzPbYj9C6oLXD9hmyY0XzgRp6_JRsAxgehjHpPPtS6AwCtNGxI_Fry3X2jcw5_cKIpT3sa8bDU3DBS_0jresASSm45uIkGV_wy05iXfzkixf061dwba83zHXUxdu4Bh1QQ6W_XWqXetfuP5F1yU8XT53xCfn3_9vPyeri5vfpxeXEzBCF4G5hkKXhunFYpgU7ChCBQGS3lGLnX2hnuWfJMouz1KCWLEZRD70zwcM5PyOfj3kNZ_q5Ym93nGnCa3IzLWq1RQoAYJXRSH8lQlloLJnsoee_Ko2Vgn7TanX3Rap-0WlC2a-2Tn55vuNqNpOLmkOvL-MiZlqMRnbs4ctgffshYbA0Z54Axl77XxiW_eus_CWyUIQ</recordid><startdate>20100901</startdate><enddate>20100901</enddate><creator>Chang, Tso-Fu Mark</creator><creator>Sone, Masato</creator><creator>Shibata, Akinobu</creator><creator>Ishiyama, Chiemi</creator><creator>Higo, Yakichi</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20100901</creationdate><title>Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath</title><author>Chang, Tso-Fu Mark ; Sone, Masato ; Shibata, Akinobu ; Ishiyama, Chiemi ; Higo, Yakichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c443t-151fcb38a76ff07f48cc4e687552d3b77a83b1fb15e5d3b2551dd06aeba8cb093</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Additive-free Watts bath</topic><topic>Additives</topic><topic>Baths</topic><topic>Bright film</topic><topic>Carbon dioxide</topic><topic>Chemistry</topic><topic>Deposition</topic><topic>Electrochemistry</topic><topic>Electrodeposition</topic><topic>Electroless plating</topic><topic>Emulsions</topic><topic>Exact sciences and technology</topic><topic>General and physical chemistry</topic><topic>Grain size</topic><topic>Nickel</topic><topic>Nickel electroplating</topic><topic>Study of interfaces</topic><topic>Supercritical carbon dioxide emulsion</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chang, Tso-Fu Mark</creatorcontrib><creatorcontrib>Sone, Masato</creatorcontrib><creatorcontrib>Shibata, Akinobu</creatorcontrib><creatorcontrib>Ishiyama, Chiemi</creatorcontrib><creatorcontrib>Higo, Yakichi</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Electrochimica acta</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chang, Tso-Fu Mark</au><au>Sone, Masato</au><au>Shibata, Akinobu</au><au>Ishiyama, Chiemi</au><au>Higo, Yakichi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath</atitle><jtitle>Electrochimica acta</jtitle><date>2010-09-01</date><risdate>2010</risdate><volume>55</volume><issue>22</issue><spage>6469</spage><epage>6475</epage><pages>6469-6475</pages><issn>0013-4686</issn><eissn>1873-3859</eissn><coden>ELCAAV</coden><abstract>This paper is aimed on studying film smoothening effect of supercritical carbon dioxide emulsion (Sc-CO
2-E) on nickel film electroplated using an additive-free Watts bath. Morphology of nickel film electroplated with Sc-CO
2-E was found to be similar to that of nickel film prepared from electroless plating. Surface roughness (
R
a) of nickel film electroplated with Sc-CO
2-E was lower than that of nickel film electroplated through conventional method. A minimum
R
a was found for nickel film electroplated through conventional method and Sc-CO
2-E when increasing current density from 0.010 to 0.150
A/cm
2. The minimum
R
a was 69.8
nm at 0.020
A/cm
2 and 14.0
nm at 0.030
A/cm
2, respectively for conventional and Sc-CO
2-E case. After the minimum point, increasing rate of
R
a increased was lower for Sc-CO
2-E case; this was because of higher hydrogen solubility in Sc-CO
2. Grain size of nickel film electroplated with Sc-CO
2-E was found to be finer than that of conventional case.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.electacta.2010.06.037</doi><tpages>7</tpages></addata></record> |
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source | Access via ScienceDirect (Elsevier) |
subjects | Additive-free Watts bath Additives Baths Bright film Carbon dioxide Chemistry Deposition Electrochemistry Electrodeposition Electroless plating Emulsions Exact sciences and technology General and physical chemistry Grain size Nickel Nickel electroplating Study of interfaces Supercritical carbon dioxide emulsion |
title | Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath |
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