PWB Micro-Structural Influences over Drop Reliability in Mobile Devices

Printed wiring board (PWB) for mobile devices continues to have higher wiring density and more complicated structures from functionality requirements in addition to product size restriction. With enhancing the functionality, PWB failures occurred by drop impact is one of the most critical stresses t...

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Veröffentlicht in:	Journal of Solid Mechanics and Materials Engineering 2010, Vol.4(1), pp.24-38
Hauptverfasser:	KATAHIRA, Takayoshi, FUJITA, Masato, YU, Qiang
Format:	Artikel
Sprache:	eng
Schlagworte:	Assembly BGA Circuit boards Density Drop Reliability Electronic Material Impact tests Materials engineering Micromechanics Microvia Mobile Mobile communication systems Printed circuits PWB Simulation Solid mechanics Structural Reliability
Online-Zugang:	Volltext
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