Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

The ever increasing power density in high performance microelectronic devices for applications such as large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid arr...

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Veröffentlicht in:	Microelectronics and reliability 2010-12, Vol.50 (12), p.2037-2050
Hauptverfasser:	Chiu, Tz-Cheng, Lin, Jyun-Ji, Yang, Hung-Chun, Gupta, Vikas
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Arrays Bridging Cold flow Collapse Creep (materials) Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Failure Heat sinks Integrated circuits Mathematical models Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders
Online-Zugang:	Volltext
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