Influence of gold pick up on the hardness of copper free air ball
The effect of substrate material pick up by the Cu wire tail on the hardness of the subsequently formed free air ball (FAB) is investigated with scanning electron microscopy (SEM) and micro-hardness test. The Cu wire bonds are made on Au metallization. Wire residue is not found on the imprint the ta...
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| Veröffentlicht in: | Microelectronics and reliability 2011, Vol.51 (1), p.30-37 |
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| creator | Lee, J. Mayer, M. Zhou, Y. Moon, J.T. Persic, J. |
| description | The effect of substrate material pick up by the Cu wire tail on the hardness of the subsequently formed free air ball (FAB) is investigated with scanning electron microscopy (SEM) and micro-hardness test. The Cu wire bonds are made on Au metallization. Wire residue is not found on the imprint the tail bond leaves on the metallization, but fracture of the substrate metallization is evident. SEM images of the Cu wire tail end clearly show Au residue (pick up). The amount of Au pick up is estimated higher than 0.03% of the volume of a subsequently formed 50
μm diameter FAB, exceeding typical impurity and dopant concentrations (0.01%). Lowering the impact force process parameter is found to strongly increase the amount of substrate material pick up. Cu free air balls (50
μm in diameter) formed with an estimated Au pick up volume of 50
μm
3 are found to be between 1.2
HV and 4.3
HV softer than those without pick up. However, the hardness varies significantly more than that of FABs without pick up. |
| doi_str_mv | 10.1016/j.microrel.2010.03.014 |
| format | Article |
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μm diameter FAB, exceeding typical impurity and dopant concentrations (0.01%). Lowering the impact force process parameter is found to strongly increase the amount of substrate material pick up. Cu free air balls (50
μm in diameter) formed with an estimated Au pick up volume of 50
μm
3 are found to be between 1.2
HV and 4.3
HV softer than those without pick up. However, the hardness varies significantly more than that of FABs without pick up.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2010.03.014</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Copper ; Gold ; Hardness ; Metallizing ; Picks ; Residues ; Scanning electron microscopy ; Wire</subject><ispartof>Microelectronics and reliability, 2011, Vol.51 (1), p.30-37</ispartof><rights>2010 Elsevier Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c344t-ff665007df2b23824eba97fe64a6ea0ac72622865058215680439dce3031f5a3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.microrel.2010.03.014$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>315,781,785,3551,4025,27927,27928,27929,45999</link.rule.ids></links><search><creatorcontrib>Lee, J.</creatorcontrib><creatorcontrib>Mayer, M.</creatorcontrib><creatorcontrib>Zhou, Y.</creatorcontrib><creatorcontrib>Moon, J.T.</creatorcontrib><creatorcontrib>Persic, J.</creatorcontrib><title>Influence of gold pick up on the hardness of copper free air ball</title><title>Microelectronics and reliability</title><description>The effect of substrate material pick up by the Cu wire tail on the hardness of the subsequently formed free air ball (FAB) is investigated with scanning electron microscopy (SEM) and micro-hardness test. The Cu wire bonds are made on Au metallization. Wire residue is not found on the imprint the tail bond leaves on the metallization, but fracture of the substrate metallization is evident. SEM images of the Cu wire tail end clearly show Au residue (pick up). The amount of Au pick up is estimated higher than 0.03% of the volume of a subsequently formed 50
μm diameter FAB, exceeding typical impurity and dopant concentrations (0.01%). Lowering the impact force process parameter is found to strongly increase the amount of substrate material pick up. Cu free air balls (50
μm in diameter) formed with an estimated Au pick up volume of 50
μm
3 are found to be between 1.2
HV and 4.3
HV softer than those without pick up. However, the hardness varies significantly more than that of FABs without pick up.</description><subject>Copper</subject><subject>Gold</subject><subject>Hardness</subject><subject>Metallizing</subject><subject>Picks</subject><subject>Residues</subject><subject>Scanning electron microscopy</subject><subject>Wire</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNqFkEtPwzAQhC0EEqXwF5BvnBL8ipPeqCoelSpx6YGb5Tpr6uLGwU6Q-Pc4Kpw5rbQ7M6v5ELqlpKSEyvtDeXQmhgi-ZCQvCS8JFWdoRpuaFQtB387RjBAmC1ZTcYmuUjoQQmpC6Qwt1531I3QGcLD4PfgW98584LHHocPDHvBex7aDlKa7CX0PEdsIgLWLeKe9v0YXVvsEN79zjrZPj9vVS7F5fV6vlpvCcCGGwlopq_y1tWzHeMME7PSitiCFlqCJNjWTjDVZUzWMVrIhgi9aA5xwaivN5-juFNvH8DlCGtTRJQPe6w7CmFRTVTXNATQr5UmZoaQUwao-uqOO34oSNRFTB_VHTE3EFOEqE8vGh5MRco0vB1El4yY0rYtgBtUG91_ED1P4dn0</recordid><startdate>2011</startdate><enddate>2011</enddate><creator>Lee, J.</creator><creator>Mayer, M.</creator><creator>Zhou, Y.</creator><creator>Moon, J.T.</creator><creator>Persic, J.</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2011</creationdate><title>Influence of gold pick up on the hardness of copper free air ball</title><author>Lee, J. ; Mayer, M. ; Zhou, Y. ; Moon, J.T. ; Persic, J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c344t-ff665007df2b23824eba97fe64a6ea0ac72622865058215680439dce3031f5a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Copper</topic><topic>Gold</topic><topic>Hardness</topic><topic>Metallizing</topic><topic>Picks</topic><topic>Residues</topic><topic>Scanning electron microscopy</topic><topic>Wire</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, J.</creatorcontrib><creatorcontrib>Mayer, M.</creatorcontrib><creatorcontrib>Zhou, Y.</creatorcontrib><creatorcontrib>Moon, J.T.</creatorcontrib><creatorcontrib>Persic, J.</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, J.</au><au>Mayer, M.</au><au>Zhou, Y.</au><au>Moon, J.T.</au><au>Persic, J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of gold pick up on the hardness of copper free air ball</atitle><jtitle>Microelectronics and reliability</jtitle><date>2011</date><risdate>2011</risdate><volume>51</volume><issue>1</issue><spage>30</spage><epage>37</epage><pages>30-37</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><abstract>The effect of substrate material pick up by the Cu wire tail on the hardness of the subsequently formed free air ball (FAB) is investigated with scanning electron microscopy (SEM) and micro-hardness test. The Cu wire bonds are made on Au metallization. Wire residue is not found on the imprint the tail bond leaves on the metallization, but fracture of the substrate metallization is evident. SEM images of the Cu wire tail end clearly show Au residue (pick up). The amount of Au pick up is estimated higher than 0.03% of the volume of a subsequently formed 50
μm diameter FAB, exceeding typical impurity and dopant concentrations (0.01%). Lowering the impact force process parameter is found to strongly increase the amount of substrate material pick up. Cu free air balls (50
μm in diameter) formed with an estimated Au pick up volume of 50
μm
3 are found to be between 1.2
HV and 4.3
HV softer than those without pick up. However, the hardness varies significantly more than that of FABs without pick up.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2010.03.014</doi><tpages>8</tpages></addata></record> |
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| ispartof | Microelectronics and reliability, 2011, Vol.51 (1), p.30-37 |
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| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | Copper Gold Hardness Metallizing Picks Residues Scanning electron microscopy Wire |
| title | Influence of gold pick up on the hardness of copper free air ball |
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