Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding
The development of novel Cu wires for thermosonic wire bonding is time consuming and the effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An online method is used in this study for characterizing Cu free air balls (FABs) formed with different shielding gas...
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| Veröffentlicht in: | Microelectronics and reliability 2011, Vol.51 (1), p.43-52 |
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| creator | Pequegnat, A. Kim, H.J. Mayer, M. Zhou, Y. Persic, J. Moon, J.T. |
| description | The development of novel Cu wires for thermosonic wire bonding is time consuming and the effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An online method is used in this study for characterizing Cu free air balls (FABs) formed with different shielding gas types and flow rates. The ball heights before (
H
FAB) and after deformation (
H
def) are responses of the online method and measured as functions of gas flow rate. Sudden changes in the slopes of these functions, a non-parallelity of the two functions, and a large standard deviation of the
H
FAB measurements all identify FAB defects. Using scanning electron microscope (SEM) images in parallel with the online measurements golf-club shaped and pointed shaped FABs are found and the conditions at which they occur are identified. In general FAB defects are thought to be caused by changes in surface tension of the molten metal during EFO due to inhomogeneous cooling or oxidation. It is found that the convective cooling effect of the shielding gas increases with flow rate up to 0.65
l/min where the bulk temperature of a thermocouple at the EFO site decreases by 19
°C. Flow rates above 0.7
l/min yield an undesirable EFO process due to an increase in oxidation which can be explained by a change in flow from laminar to turbulent. The addition of H
2 to the shielding gas reduces the oxidation of the FAB as well as providing additional thermal energy during EFO. Different Cu wire materials yield different results where some perform better than others. |
| doi_str_mv | 10.1016/j.microrel.2010.02.023 |
| format | Article |
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H
FAB) and after deformation (
H
def) are responses of the online method and measured as functions of gas flow rate. Sudden changes in the slopes of these functions, a non-parallelity of the two functions, and a large standard deviation of the
H
FAB measurements all identify FAB defects. Using scanning electron microscope (SEM) images in parallel with the online measurements golf-club shaped and pointed shaped FABs are found and the conditions at which they occur are identified. In general FAB defects are thought to be caused by changes in surface tension of the molten metal during EFO due to inhomogeneous cooling or oxidation. It is found that the convective cooling effect of the shielding gas increases with flow rate up to 0.65
l/min where the bulk temperature of a thermocouple at the EFO site decreases by 19
°C. Flow rates above 0.7
l/min yield an undesirable EFO process due to an increase in oxidation which can be explained by a change in flow from laminar to turbulent. The addition of H
2 to the shielding gas reduces the oxidation of the FAB as well as providing additional thermal energy during EFO. Different Cu wire materials yield different results where some perform better than others.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2010.02.023</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Copper ; Electric wire ; Flow rate ; On-line systems ; Online ; Oxidation ; Scanning electron microscopy ; Shielding</subject><ispartof>Microelectronics and reliability, 2011, Vol.51 (1), p.43-52</ispartof><rights>2010 Elsevier Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c410t-20e42b6c43da872c7deb9fdd9c8646f96d9473d5d3146d82230784b4316929793</citedby><cites>FETCH-LOGICAL-c410t-20e42b6c43da872c7deb9fdd9c8646f96d9473d5d3146d82230784b4316929793</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.microrel.2010.02.023$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>315,781,785,3551,4025,27925,27926,27927,45997</link.rule.ids></links><search><creatorcontrib>Pequegnat, A.</creatorcontrib><creatorcontrib>Kim, H.J.</creatorcontrib><creatorcontrib>Mayer, M.</creatorcontrib><creatorcontrib>Zhou, Y.</creatorcontrib><creatorcontrib>Persic, J.</creatorcontrib><creatorcontrib>Moon, J.T.</creatorcontrib><title>Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding</title><title>Microelectronics and reliability</title><description>The development of novel Cu wires for thermosonic wire bonding is time consuming and the effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An online method is used in this study for characterizing Cu free air balls (FABs) formed with different shielding gas types and flow rates. The ball heights before (
H
FAB) and after deformation (
H
def) are responses of the online method and measured as functions of gas flow rate. Sudden changes in the slopes of these functions, a non-parallelity of the two functions, and a large standard deviation of the
H
FAB measurements all identify FAB defects. Using scanning electron microscope (SEM) images in parallel with the online measurements golf-club shaped and pointed shaped FABs are found and the conditions at which they occur are identified. In general FAB defects are thought to be caused by changes in surface tension of the molten metal during EFO due to inhomogeneous cooling or oxidation. It is found that the convective cooling effect of the shielding gas increases with flow rate up to 0.65
l/min where the bulk temperature of a thermocouple at the EFO site decreases by 19
°C. Flow rates above 0.7
l/min yield an undesirable EFO process due to an increase in oxidation which can be explained by a change in flow from laminar to turbulent. The addition of H
2 to the shielding gas reduces the oxidation of the FAB as well as providing additional thermal energy during EFO. Different Cu wire materials yield different results where some perform better than others.</description><subject>Copper</subject><subject>Electric wire</subject><subject>Flow rate</subject><subject>On-line systems</subject><subject>Online</subject><subject>Oxidation</subject><subject>Scanning electron microscopy</subject><subject>Shielding</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNqFUE1LAzEQDaJgrf4Fyc3T1iSbzW5uSqkfUPCiIF5CNpnUlN1NTbaW_ntTqmdhYGDeB_MeQteUzCih4nY9672JIUI3YyQfCctTnqAJbWpWSE7fT9GEECYKVlN-ji5SWhNCakLpBH0snAMz4uDwSic87jeA9WCx68IORz0CDgOeb7GLkAEfcau7DrsQez36DPkBj58Q-5DC4A3e-Qi4DYP1w-oSnTndJbj63VP09rB4nT8Vy5fH5_n9sjCckrFgBDhrheGl1flhU1topbNWmkZw4aSwktelrWxJubANYyWpG97ykgrJZC3LKbo5-m5i-NpCGlXvk4Gu0wOEbVJNVdWUyurAFEdmriulCE5tou913CtK1KFLtVZ_XapDl4qwPGUW3h2FkHN8e4gqGQ-DAZvzmlHZ4P-z-AG6U4AI</recordid><startdate>2011</startdate><enddate>2011</enddate><creator>Pequegnat, A.</creator><creator>Kim, H.J.</creator><creator>Mayer, M.</creator><creator>Zhou, Y.</creator><creator>Persic, J.</creator><creator>Moon, J.T.</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2011</creationdate><title>Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding</title><author>Pequegnat, A. ; Kim, H.J. ; Mayer, M. ; Zhou, Y. ; Persic, J. ; Moon, J.T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c410t-20e42b6c43da872c7deb9fdd9c8646f96d9473d5d3146d82230784b4316929793</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Copper</topic><topic>Electric wire</topic><topic>Flow rate</topic><topic>On-line systems</topic><topic>Online</topic><topic>Oxidation</topic><topic>Scanning electron microscopy</topic><topic>Shielding</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pequegnat, A.</creatorcontrib><creatorcontrib>Kim, H.J.</creatorcontrib><creatorcontrib>Mayer, M.</creatorcontrib><creatorcontrib>Zhou, Y.</creatorcontrib><creatorcontrib>Persic, J.</creatorcontrib><creatorcontrib>Moon, J.T.</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Pequegnat, A.</au><au>Kim, H.J.</au><au>Mayer, M.</au><au>Zhou, Y.</au><au>Persic, J.</au><au>Moon, J.T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding</atitle><jtitle>Microelectronics and reliability</jtitle><date>2011</date><risdate>2011</risdate><volume>51</volume><issue>1</issue><spage>43</spage><epage>52</epage><pages>43-52</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><abstract>The development of novel Cu wires for thermosonic wire bonding is time consuming and the effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An online method is used in this study for characterizing Cu free air balls (FABs) formed with different shielding gas types and flow rates. The ball heights before (
H
FAB) and after deformation (
H
def) are responses of the online method and measured as functions of gas flow rate. Sudden changes in the slopes of these functions, a non-parallelity of the two functions, and a large standard deviation of the
H
FAB measurements all identify FAB defects. Using scanning electron microscope (SEM) images in parallel with the online measurements golf-club shaped and pointed shaped FABs are found and the conditions at which they occur are identified. In general FAB defects are thought to be caused by changes in surface tension of the molten metal during EFO due to inhomogeneous cooling or oxidation. It is found that the convective cooling effect of the shielding gas increases with flow rate up to 0.65
l/min where the bulk temperature of a thermocouple at the EFO site decreases by 19
°C. Flow rates above 0.7
l/min yield an undesirable EFO process due to an increase in oxidation which can be explained by a change in flow from laminar to turbulent. The addition of H
2 to the shielding gas reduces the oxidation of the FAB as well as providing additional thermal energy during EFO. Different Cu wire materials yield different results where some perform better than others.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2010.02.023</doi><tpages>10</tpages></addata></record> |
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| subjects | Copper Electric wire Flow rate On-line systems Online Oxidation Scanning electron microscopy Shielding |
| title | Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding |
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