Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

▶ We used a revised solder joints with one-dimension geometry that can help us to investigate the true failure mechanisms of solder joints induced by EM. ▶ One of possible solutions to inhibit the EM effect to solder joint can be achieved by adding micro- or nano-sized metal particles into it. ▶ Mic...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of alloys and compounds 2011-01, Vol.509 (3), p.878-884
Hauptverfasser:	Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Composite solder Diffusion Electromigration Electronics Eutectic SnBi Eutectics Exact sciences and technology Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Microelectronic fabrication (materials and surfaces technology) Ni particle Nickel Particulate composites Phase boundaries Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Tin Welding
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!