Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications
A new low‐permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state cera...
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| Veröffentlicht in: | International journal of applied ceramic technology 2010-07, Vol.7 (4), p.461-474 |
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| container_title | International journal of applied ceramic technology |
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| creator | George, Sumesh Anjana, Prabhakaran S. Sebastian, Mailadil T. Krupka, Jerzy Uma, Sreekumar Philip, Jacob |
| description | A new low‐permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li2MgSiO4‐reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models. |
| doi_str_mv | 10.1111/j.1744-7402.2010.02510.x |
| format | Article |
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The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li2MgSiO4‐reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. 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The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li2MgSiO4‐reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models.</description><subject>Ceramics</subject><subject>Dielectric constant</subject><subject>Dielectric properties</subject><subject>Heat transfer</subject><subject>Molding (process)</subject><subject>Polymer matrix composites</subject><subject>Thermal conductivity</subject><subject>Thermal expansion</subject><subject>Thermal properties</subject><issn>1546-542X</issn><issn>1744-7402</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNqNkU9v1DAQxSMEEqXwHXyDQ7P4v-MTWlJoi7awQkX0Zhlnonpx1sFO6e6Fz463QT0CPtgjz--9keZVFSJ4Qcp5vVkQxXmtOKYLissvpqLcu0fV0UPjcakFl7Xg9Ppp9SznDcaMMyaPql-nHgK4KXl3gi7B3ditdzacILvt0NUNpMEGtE5xhDR5yCj2aBXv6nVp-GnyP_20R-sY9gOkuoVkB-9QG4cxZj8VvI8JXXqX4jwkFnO0HMdQZkw-bvPz6klvQ4YXf97j6sv7d1fteb36dHbRLle1E0TiutcdV6RrBGaqZ9BwZ6lUtNNCAWWd7jWT30iHGbYSOkUACLO6FxwarIhU7Lh6OfuOKf64hTyZwWcHIdgtxNtsGq65aDCl_ySVYFJo1ZBCvvorSaSmDOtGyoI2M1o2kXOC3ozJDzbtDcHmEKPZmENa5pCWOcRo7mM0uyJ9M0vvfID9f-vMxYdle18Xh3p28HmC3YODTd9N2YwS5uvHM4NP-ee31-fFif0GC2qzgw</recordid><startdate>201007</startdate><enddate>201007</enddate><creator>George, Sumesh</creator><creator>Anjana, Prabhakaran S.</creator><creator>Sebastian, Mailadil T.</creator><creator>Krupka, Jerzy</creator><creator>Uma, Sreekumar</creator><creator>Philip, Jacob</creator><general>Blackwell Publishing Inc</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>201007</creationdate><title>Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications</title><author>George, Sumesh ; Anjana, Prabhakaran S. ; Sebastian, Mailadil T. ; Krupka, Jerzy ; Uma, Sreekumar ; Philip, Jacob</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c5160-f9d471d85037f3e84ca2672d957e23d9f936b1d030a6ed71ee13a9f54e8071673</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Ceramics</topic><topic>Dielectric constant</topic><topic>Dielectric properties</topic><topic>Heat transfer</topic><topic>Molding (process)</topic><topic>Polymer matrix composites</topic><topic>Thermal conductivity</topic><topic>Thermal expansion</topic><topic>Thermal properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>George, Sumesh</creatorcontrib><creatorcontrib>Anjana, Prabhakaran S.</creatorcontrib><creatorcontrib>Sebastian, Mailadil T.</creatorcontrib><creatorcontrib>Krupka, Jerzy</creatorcontrib><creatorcontrib>Uma, Sreekumar</creatorcontrib><creatorcontrib>Philip, Jacob</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>International journal of applied ceramic technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>George, Sumesh</au><au>Anjana, Prabhakaran S.</au><au>Sebastian, Mailadil T.</au><au>Krupka, Jerzy</au><au>Uma, Sreekumar</au><au>Philip, Jacob</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications</atitle><jtitle>International journal of applied ceramic technology</jtitle><date>2010-07</date><risdate>2010</risdate><volume>7</volume><issue>4</issue><spage>461</spage><epage>474</epage><pages>461-474</pages><issn>1546-542X</issn><eissn>1744-7402</eissn><abstract>A new low‐permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic‐reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low‐loss, low‐permittivity Li2MgSiO4 (LMS) ceramics prepared by the solid‐state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li2MgSiO4‐reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models.</abstract><cop>Malden, USA</cop><pub>Blackwell Publishing Inc</pub><doi>10.1111/j.1744-7402.2010.02510.x</doi><tpages>14</tpages></addata></record> |
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| identifier | ISSN: 1546-542X |
| ispartof | International journal of applied ceramic technology, 2010-07, Vol.7 (4), p.461-474 |
| issn | 1546-542X 1744-7402 |
| language | eng |
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| source | Wiley Online Library Journals Frontfile Complete |
| subjects | Ceramics Dielectric constant Dielectric properties Heat transfer Molding (process) Polymer matrix composites Thermal conductivity Thermal expansion Thermal properties |
| title | Dielectric, Mechanical, and Thermal Properties of Low-Permittivity Polymer-Ceramic Composites for Microelectronic Applications |
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