Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

In order to improve electronics packaging design, it is important to evaluate the cooling performance and reliability of the electronics packaging structure of a product. To that end, it is necessary to predict the temperature, deformation, and stress distributions of the package under field conditi...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2010-06, Vol.33 (2), p.347-358
Hauptverfasser:	Hirohata, Kenji, Hisano, Katsumi, Mukai, Minoru, Aoki, Hideo, Takubo, Chiaki, Kawakami, Takashi, Pecht, Michael G
Format:	Artikel
Sprache:	eng
Schlagworte:	Contact Contact pressure Contact resistance Cooling Electronic packaging thermal management Electronics cooling Electronics packaging Heat transfer Packages Packaging probabilistic approximation reliability modeling Resistance heating simulation Soldering Solders Studies Temperature distribution Thermal conductivity Thermal energy Thermal resistance Thermal stresses
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