Estimation of Power Switching Current by Chip-Package-PCB Cosimulation
This paper presents a methodology to estimate power switching current on printed circuit boards (PCBs) through chip-package-PCB cosimulation. A macromodel for a timing controller chip running pseudo H-pattern data was generated from transistor-level simulations. The macromodel consists of a passive...
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| Veröffentlicht in: | IEEE transactions on electromagnetic compatibility 2010-05, Vol.52 (2), p.311-319 |
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| container_title | IEEE transactions on electromagnetic compatibility |
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| creator | Park, Hyun Ho Song, Seung-Hyun Han, Sang-Tae Jang, Tae-Sun Jung, Jin-Hwan Park, Hark-Byeong |
| description | This paper presents a methodology to estimate power switching current on printed circuit boards (PCBs) through chip-package-PCB cosimulation. A macromodel for a timing controller chip running pseudo H-pattern data was generated from transistor-level simulations. The macromodel consists of a passive impedance network and internal switching activity of the chip. Power delivery network models for package and PCB were produced as a RLCG netlist and S-parameter touch stone files, respectively, using commercial tools. It is found that comparison between the simulated and measured impedances of the chip and package shows excellent agreement up to 300 MHz. Also, the simulated and measured impedances of the PCB match well in terms of magnitude and resonance frequency up to 3 GHz. Moreover, the results of power switching current from cosimulation and measurement show good agreement within 5 dB difference at major harmonic frequencies of 20 MHz data and 80 MHz clock patterns up to 1 GHz. |
| doi_str_mv | 10.1109/TEMC.2010.2043255 |
| format | Article |
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A macromodel for a timing controller chip running pseudo H-pattern data was generated from transistor-level simulations. The macromodel consists of a passive impedance network and internal switching activity of the chip. Power delivery network models for package and PCB were produced as a RLCG netlist and S-parameter touch stone files, respectively, using commercial tools. It is found that comparison between the simulated and measured impedances of the chip and package shows excellent agreement up to 300 MHz. Also, the simulated and measured impedances of the PCB match well in terms of magnitude and resonance frequency up to 3 GHz. Moreover, the results of power switching current from cosimulation and measurement show good agreement within 5 dB difference at major harmonic frequencies of 20 MHz data and 80 MHz clock patterns up to 1 GHz.</description><identifier>ISSN: 0018-9375</identifier><identifier>EISSN: 1558-187X</identifier><identifier>DOI: 10.1109/TEMC.2010.2043255</identifier><identifier>CODEN: IEMCAE</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Automotive ; Chips ; Circuit boards ; Computer simulation ; cosimulation ; Electromagnetic interference ; electromagnetic interference (EMI) ; IC emission model (ICEM) ; Impedance ; Impedance measurement ; integrated circuit (IC) ; Integrated circuit modeling ; macromodel ; Networks ; Packages ; power integrity (PI) ; power noise transfer function ; power switching current ; printed circuit board (PCB) ; Printed circuits ; Semiconductor device measurement ; Switches ; Switching ; Switching theory ; timing controller (T-con) chip</subject><ispartof>IEEE transactions on electromagnetic compatibility, 2010-05, Vol.52 (2), p.311-319</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) May 2010</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c391t-893f0e9e8cb1e0b7f71514272c7ad783d2f7e658093c58b238d056abdbd3a28a3</citedby><cites>FETCH-LOGICAL-c391t-893f0e9e8cb1e0b7f71514272c7ad783d2f7e658093c58b238d056abdbd3a28a3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5462837$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5462837$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Park, Hyun Ho</creatorcontrib><creatorcontrib>Song, Seung-Hyun</creatorcontrib><creatorcontrib>Han, Sang-Tae</creatorcontrib><creatorcontrib>Jang, Tae-Sun</creatorcontrib><creatorcontrib>Jung, Jin-Hwan</creatorcontrib><creatorcontrib>Park, Hark-Byeong</creatorcontrib><title>Estimation of Power Switching Current by Chip-Package-PCB Cosimulation</title><title>IEEE transactions on electromagnetic compatibility</title><addtitle>TEMC</addtitle><description>This paper presents a methodology to estimate power switching current on printed circuit boards (PCBs) through chip-package-PCB cosimulation. A macromodel for a timing controller chip running pseudo H-pattern data was generated from transistor-level simulations. The macromodel consists of a passive impedance network and internal switching activity of the chip. Power delivery network models for package and PCB were produced as a RLCG netlist and S-parameter touch stone files, respectively, using commercial tools. It is found that comparison between the simulated and measured impedances of the chip and package shows excellent agreement up to 300 MHz. Also, the simulated and measured impedances of the PCB match well in terms of magnitude and resonance frequency up to 3 GHz. Moreover, the results of power switching current from cosimulation and measurement show good agreement within 5 dB difference at major harmonic frequencies of 20 MHz data and 80 MHz clock patterns up to 1 GHz.</description><subject>Automotive</subject><subject>Chips</subject><subject>Circuit boards</subject><subject>Computer simulation</subject><subject>cosimulation</subject><subject>Electromagnetic interference</subject><subject>electromagnetic interference (EMI)</subject><subject>IC emission model (ICEM)</subject><subject>Impedance</subject><subject>Impedance measurement</subject><subject>integrated circuit (IC)</subject><subject>Integrated circuit modeling</subject><subject>macromodel</subject><subject>Networks</subject><subject>Packages</subject><subject>power integrity (PI)</subject><subject>power noise transfer function</subject><subject>power switching current</subject><subject>printed circuit board (PCB)</subject><subject>Printed circuits</subject><subject>Semiconductor device measurement</subject><subject>Switches</subject><subject>Switching</subject><subject>Switching theory</subject><subject>timing controller (T-con) chip</subject><issn>0018-9375</issn><issn>1558-187X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkF1LwzAUhoMoOKc_QLwpeOFVZz6aJbnU0qkwceAE70Kapltm18ykZezfm7nhhVeHF573nMMDwDWCI4SguJ8Xr_kIwxgxzAim9AQMEKU8RZx9noIBhIingjB6Di5CWMWYUUwGYFKEzq5VZ12buDqZua3xyfvWdnpp20WS996btkvKXZIv7SadKf2lFiad5Y9J7oJd981v9xKc1aoJ5uo4h-BjUszz53T69vSSP0xTTQTqUi5IDY0wXJfIwJLVDFGUYYY1UxXjpMI1M2PKoSCa8hITXkE6VmVVVkRhrsgQ3B32brz77k3o5NoGbZpGtcb1QTJKGKGUsUje_iNXrvdtfE4iiBniQlAUKXSgtHcheFPLjY86_C5Cci9W7sXKvVh5FBs7N4eONcb88TQbYx6P_wAc2XLE</recordid><startdate>201005</startdate><enddate>201005</enddate><creator>Park, Hyun Ho</creator><creator>Song, Seung-Hyun</creator><creator>Han, Sang-Tae</creator><creator>Jang, Tae-Sun</creator><creator>Jung, Jin-Hwan</creator><creator>Park, Hark-Byeong</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>201005</creationdate><title>Estimation of Power Switching Current by Chip-Package-PCB Cosimulation</title><author>Park, Hyun Ho ; Song, Seung-Hyun ; Han, Sang-Tae ; Jang, Tae-Sun ; Jung, Jin-Hwan ; Park, Hark-Byeong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c391t-893f0e9e8cb1e0b7f71514272c7ad783d2f7e658093c58b238d056abdbd3a28a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Automotive</topic><topic>Chips</topic><topic>Circuit boards</topic><topic>Computer simulation</topic><topic>cosimulation</topic><topic>Electromagnetic interference</topic><topic>electromagnetic interference (EMI)</topic><topic>IC emission model (ICEM)</topic><topic>Impedance</topic><topic>Impedance measurement</topic><topic>integrated circuit (IC)</topic><topic>Integrated circuit modeling</topic><topic>macromodel</topic><topic>Networks</topic><topic>Packages</topic><topic>power integrity (PI)</topic><topic>power noise transfer function</topic><topic>power switching current</topic><topic>printed circuit board (PCB)</topic><topic>Printed circuits</topic><topic>Semiconductor device measurement</topic><topic>Switches</topic><topic>Switching</topic><topic>Switching theory</topic><topic>timing controller (T-con) chip</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Park, Hyun Ho</creatorcontrib><creatorcontrib>Song, Seung-Hyun</creatorcontrib><creatorcontrib>Han, Sang-Tae</creatorcontrib><creatorcontrib>Jang, Tae-Sun</creatorcontrib><creatorcontrib>Jung, Jin-Hwan</creatorcontrib><creatorcontrib>Park, Hark-Byeong</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on electromagnetic compatibility</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Park, Hyun Ho</au><au>Song, Seung-Hyun</au><au>Han, Sang-Tae</au><au>Jang, Tae-Sun</au><au>Jung, Jin-Hwan</au><au>Park, Hark-Byeong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Estimation of Power Switching Current by Chip-Package-PCB Cosimulation</atitle><jtitle>IEEE transactions on electromagnetic compatibility</jtitle><stitle>TEMC</stitle><date>2010-05</date><risdate>2010</risdate><volume>52</volume><issue>2</issue><spage>311</spage><epage>319</epage><pages>311-319</pages><issn>0018-9375</issn><eissn>1558-187X</eissn><coden>IEMCAE</coden><abstract>This paper presents a methodology to estimate power switching current on printed circuit boards (PCBs) through chip-package-PCB cosimulation. A macromodel for a timing controller chip running pseudo H-pattern data was generated from transistor-level simulations. The macromodel consists of a passive impedance network and internal switching activity of the chip. Power delivery network models for package and PCB were produced as a RLCG netlist and S-parameter touch stone files, respectively, using commercial tools. It is found that comparison between the simulated and measured impedances of the chip and package shows excellent agreement up to 300 MHz. Also, the simulated and measured impedances of the PCB match well in terms of magnitude and resonance frequency up to 3 GHz. Moreover, the results of power switching current from cosimulation and measurement show good agreement within 5 dB difference at major harmonic frequencies of 20 MHz data and 80 MHz clock patterns up to 1 GHz.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TEMC.2010.2043255</doi><tpages>9</tpages></addata></record> |
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| source | IEEE Electronic Library (IEL) |
| subjects | Automotive Chips Circuit boards Computer simulation cosimulation Electromagnetic interference electromagnetic interference (EMI) IC emission model (ICEM) Impedance Impedance measurement integrated circuit (IC) Integrated circuit modeling macromodel Networks Packages power integrity (PI) power noise transfer function power switching current printed circuit board (PCB) Printed circuits Semiconductor device measurement Switches Switching Switching theory timing controller (T-con) chip |
| title | Estimation of Power Switching Current by Chip-Package-PCB Cosimulation |
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