Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints

A fatigue model to predict the number of cycles for crack initiation and crack growth rate in Sn4.0Ag0.5Cu solder joints used in plastic ball grid array packages when subjected to accelerated thermal cycling has been developed. In addition to the conventionally used damage metrics such as accumulate...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2010-03, Vol.33 (1), p.84-97
Hauptverfasser:	Tunga, K., Sitaraman, S.K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Capacitive sensors CRACK growth Crack propagation cross-sectioning Electronic packaging thermal management Electronics packaging Environmentally friendly manufacturing techniques Fatigue Fatigue (materials) Fatigue failure Fatigue life fatigue model Finite element methods finite-element modeling Lead lead-free solder Life estimation Mathematical models Packages plastic ball grid array Predictive models SAC405 Soldering Solders Strain Weibull
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