LTCC-based vertical via interconnects for RF MEMS packaging

This article reports on a low temperature cofired ceramic (LTCC)‐based RF MEMS packaging and its electrical modeling using lumped elements and microstrip lines. An LTCC cap with vertical vias was flip‐chip bonded with a glass substrate, where a coplanar waveguide (CPW) formed to measure the RF chara...

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Veröffentlicht in:	Microwave and optical technology letters 2010-02, Vol.52 (2), p.252-257
Hauptverfasser:	Bang, Yong-Seung, Kim, Jung-Mu, Kim, Jong-Man, Kim, Yong-Kweon, Jang, Yun-Ho
Format:	Artikel
Sprache:	eng
Schlagworte:	electrical modeling Equivalent circuits LTCC Mathematical models Microelectromechanical systems Microstrip lines Microwaves Noise levels Packaging Radio frequencies RF MEMS packaging vertical interconnect
Online-Zugang:	Volltext
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