Operating window for the peeling of polyimide film
The peeling behavior of polyimide film coated on steel substrates was experimentally investigated and compared with existing models. An operating window for peeling, which is defined as a closed domain for steady and defect‐free peeling, is presented in terms of peeling force versus residual solvent...
Gespeichert in:
| Veröffentlicht in: | Polymer engineering and science 2010-06, Vol.50 (6), p.1128-1139 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1139 |
|---|---|
| container_issue | 6 |
| container_start_page | 1128 |
| container_title | Polymer engineering and science |
| container_volume | 50 |
| creator | Wang, Han-Yi Liu, Ta-Jo Liu, Shur-Fen Jeng, Jhy-Long |
| description | The peeling behavior of polyimide film coated on steel substrates was experimentally investigated and compared with existing models. An operating window for peeling, which is defined as a closed domain for steady and defect‐free peeling, is presented in terms of peeling force versus residual solvent content. The window is bounded by two major defects: the film becomes too brittle for peeling at high peeling force, and stick‐slip striation defect appears at low peeling force. There exists a critical residual solvent content below which the adhesion between the polyimide film and the substrate is too strong and then peeling is impossible. Existing models for predicting steady peeling and the onset of peeling defects have been modified and applied to setup the boundaries of the operating window. There also exists another operating window for drying of polyimide and is presented in the form of drying temperature versus film thickness. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers |
| doi_str_mv | 10.1002/pen.21633 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_proqu</sourceid><recordid>TN_cdi_proquest_miscellaneous_753655503</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A229228834</galeid><sourcerecordid>A229228834</sourcerecordid><originalsourceid>FETCH-LOGICAL-c5723-91a9a9c6a77e8a83888861115ee4b0abbd4e8240c102916924ca7cc09dcf0f323</originalsourceid><addsrcrecordid>eNp1ku9r1DAYx4soeE5f-B8URcbA3vKzTV-OMefc2ERPhL0JufRpl9kmNWm53X9v6p3Dk5NAAuHz_T55vnmS5DVGc4wQOe7BzgnOKX2SzDBnIiM5ZU-TGUKUZFQI8Tx5EcI9iizl5SwhNz14NRjbpCtjK7dKa-fT4Q7SHqCdrl2d9q5dm85UkNam7V4mz2rVBni1PQ-Sbx_OFqcfs6ub84vTk6tM84LQrMSqVKXOVVGAUGKqLXKMMQdgS6SWy4qBIAxpjEiJ85IwrQqtUVnpGtWU0IPkcOPbe_dzhDDIzgQNbassuDHIgtOcc45oJN_8Q9670dv4OEnznGGEKYrQ2w3UqBaksbUbvNKTpTwhpCRECMoile2hGrAxpdZZiAHALj_fw8dVQWf0XsHRjiAyAzwMjRpDkBdfv-yy7_9il2MwFkLcgmnuhrCR7LPW3oXgoZa9N53ya4mRnKZDxumQv6cjsu-2kamgVVt7ZbUJj4LoSBHj0yccb7hV7GP9f0P5-ez6j_M2QRNiY48K5X_IvKAFl9-vz-Xi9hO6XNxeSk5_AXDE0fs</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>366410130</pqid></control><display><type>article</type><title>Operating window for the peeling of polyimide film</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Wang, Han-Yi ; Liu, Ta-Jo ; Liu, Shur-Fen ; Jeng, Jhy-Long</creator><creatorcontrib>Wang, Han-Yi ; Liu, Ta-Jo ; Liu, Shur-Fen ; Jeng, Jhy-Long</creatorcontrib><description>The peeling behavior of polyimide film coated on steel substrates was experimentally investigated and compared with existing models. An operating window for peeling, which is defined as a closed domain for steady and defect‐free peeling, is presented in terms of peeling force versus residual solvent content. The window is bounded by two major defects: the film becomes too brittle for peeling at high peeling force, and stick‐slip striation defect appears at low peeling force. There exists a critical residual solvent content below which the adhesion between the polyimide film and the substrate is too strong and then peeling is impossible. Existing models for predicting steady peeling and the onset of peeling defects have been modified and applied to setup the boundaries of the operating window. There also exists another operating window for drying of polyimide and is presented in the form of drying temperature versus film thickness. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers</description><identifier>ISSN: 0032-3888</identifier><identifier>EISSN: 1548-2634</identifier><identifier>DOI: 10.1002/pen.21633</identifier><identifier>CODEN: PYESAZ</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Adhesive strength ; Applied sciences ; Boundaries ; Chemical properties ; Composition ; Defects ; Dielectric films ; Drying ; Exact sciences and technology ; Film thickness ; Forms of application and semi-finished materials ; Mechanical properties ; Peeling ; Polyimide resins ; Polyimides ; Polymer industry, paints, wood ; Polymers ; Production processes ; Sheets and films ; Solvents ; Technology of polymers ; Thin films</subject><ispartof>Polymer engineering and science, 2010-06, Vol.50 (6), p.1128-1139</ispartof><rights>Copyright © 2009 Society of Plastics Engineers</rights><rights>2015 INIST-CNRS</rights><rights>COPYRIGHT 2010 Society of Plastics Engineers, Inc.</rights><rights>Copyright Society of Plastics Engineers Jun 2010</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c5723-91a9a9c6a77e8a83888861115ee4b0abbd4e8240c102916924ca7cc09dcf0f323</citedby><cites>FETCH-LOGICAL-c5723-91a9a9c6a77e8a83888861115ee4b0abbd4e8240c102916924ca7cc09dcf0f323</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fpen.21633$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fpen.21633$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27903,27904,45553,45554</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22830452$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Han-Yi</creatorcontrib><creatorcontrib>Liu, Ta-Jo</creatorcontrib><creatorcontrib>Liu, Shur-Fen</creatorcontrib><creatorcontrib>Jeng, Jhy-Long</creatorcontrib><title>Operating window for the peeling of polyimide film</title><title>Polymer engineering and science</title><addtitle>Polym Eng Sci</addtitle><description>The peeling behavior of polyimide film coated on steel substrates was experimentally investigated and compared with existing models. An operating window for peeling, which is defined as a closed domain for steady and defect‐free peeling, is presented in terms of peeling force versus residual solvent content. The window is bounded by two major defects: the film becomes too brittle for peeling at high peeling force, and stick‐slip striation defect appears at low peeling force. There exists a critical residual solvent content below which the adhesion between the polyimide film and the substrate is too strong and then peeling is impossible. Existing models for predicting steady peeling and the onset of peeling defects have been modified and applied to setup the boundaries of the operating window. There also exists another operating window for drying of polyimide and is presented in the form of drying temperature versus film thickness. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers</description><subject>Adhesive strength</subject><subject>Applied sciences</subject><subject>Boundaries</subject><subject>Chemical properties</subject><subject>Composition</subject><subject>Defects</subject><subject>Dielectric films</subject><subject>Drying</subject><subject>Exact sciences and technology</subject><subject>Film thickness</subject><subject>Forms of application and semi-finished materials</subject><subject>Mechanical properties</subject><subject>Peeling</subject><subject>Polyimide resins</subject><subject>Polyimides</subject><subject>Polymer industry, paints, wood</subject><subject>Polymers</subject><subject>Production processes</subject><subject>Sheets and films</subject><subject>Solvents</subject><subject>Technology of polymers</subject><subject>Thin films</subject><issn>0032-3888</issn><issn>1548-2634</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>N95</sourceid><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1ku9r1DAYx4soeE5f-B8URcbA3vKzTV-OMefc2ERPhL0JufRpl9kmNWm53X9v6p3Dk5NAAuHz_T55vnmS5DVGc4wQOe7BzgnOKX2SzDBnIiM5ZU-TGUKUZFQI8Tx5EcI9iizl5SwhNz14NRjbpCtjK7dKa-fT4Q7SHqCdrl2d9q5dm85UkNam7V4mz2rVBni1PQ-Sbx_OFqcfs6ub84vTk6tM84LQrMSqVKXOVVGAUGKqLXKMMQdgS6SWy4qBIAxpjEiJ85IwrQqtUVnpGtWU0IPkcOPbe_dzhDDIzgQNbassuDHIgtOcc45oJN_8Q9670dv4OEnznGGEKYrQ2w3UqBaksbUbvNKTpTwhpCRECMoile2hGrAxpdZZiAHALj_fw8dVQWf0XsHRjiAyAzwMjRpDkBdfv-yy7_9il2MwFkLcgmnuhrCR7LPW3oXgoZa9N53ya4mRnKZDxumQv6cjsu-2kamgVVt7ZbUJj4LoSBHj0yccb7hV7GP9f0P5-ez6j_M2QRNiY48K5X_IvKAFl9-vz-Xi9hO6XNxeSk5_AXDE0fs</recordid><startdate>201006</startdate><enddate>201006</enddate><creator>Wang, Han-Yi</creator><creator>Liu, Ta-Jo</creator><creator>Liu, Shur-Fen</creator><creator>Jeng, Jhy-Long</creator><general>Wiley Subscription Services, Inc., A Wiley Company</general><general>Wiley</general><general>Society of Plastics Engineers, Inc</general><general>Blackwell Publishing Ltd</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>N95</scope><scope>XI7</scope><scope>ISR</scope><scope>3V.</scope><scope>7SR</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>201006</creationdate><title>Operating window for the peeling of polyimide film</title><author>Wang, Han-Yi ; Liu, Ta-Jo ; Liu, Shur-Fen ; Jeng, Jhy-Long</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c5723-91a9a9c6a77e8a83888861115ee4b0abbd4e8240c102916924ca7cc09dcf0f323</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Adhesive strength</topic><topic>Applied sciences</topic><topic>Boundaries</topic><topic>Chemical properties</topic><topic>Composition</topic><topic>Defects</topic><topic>Dielectric films</topic><topic>Drying</topic><topic>Exact sciences and technology</topic><topic>Film thickness</topic><topic>Forms of application and semi-finished materials</topic><topic>Mechanical properties</topic><topic>Peeling</topic><topic>Polyimide resins</topic><topic>Polyimides</topic><topic>Polymer industry, paints, wood</topic><topic>Polymers</topic><topic>Production processes</topic><topic>Sheets and films</topic><topic>Solvents</topic><topic>Technology of polymers</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Han-Yi</creatorcontrib><creatorcontrib>Liu, Ta-Jo</creatorcontrib><creatorcontrib>Liu, Shur-Fen</creatorcontrib><creatorcontrib>Jeng, Jhy-Long</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Gale Business: Insights</collection><collection>Business Insights: Essentials</collection><collection>Gale In Context: Science</collection><collection>ProQuest Central (Corporate)</collection><collection>Engineered Materials Abstracts</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Polymer engineering and science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Han-Yi</au><au>Liu, Ta-Jo</au><au>Liu, Shur-Fen</au><au>Jeng, Jhy-Long</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Operating window for the peeling of polyimide film</atitle><jtitle>Polymer engineering and science</jtitle><addtitle>Polym Eng Sci</addtitle><date>2010-06</date><risdate>2010</risdate><volume>50</volume><issue>6</issue><spage>1128</spage><epage>1139</epage><pages>1128-1139</pages><issn>0032-3888</issn><eissn>1548-2634</eissn><coden>PYESAZ</coden><abstract>The peeling behavior of polyimide film coated on steel substrates was experimentally investigated and compared with existing models. An operating window for peeling, which is defined as a closed domain for steady and defect‐free peeling, is presented in terms of peeling force versus residual solvent content. The window is bounded by two major defects: the film becomes too brittle for peeling at high peeling force, and stick‐slip striation defect appears at low peeling force. There exists a critical residual solvent content below which the adhesion between the polyimide film and the substrate is too strong and then peeling is impossible. Existing models for predicting steady peeling and the onset of peeling defects have been modified and applied to setup the boundaries of the operating window. There also exists another operating window for drying of polyimide and is presented in the form of drying temperature versus film thickness. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers</abstract><cop>Hoboken</cop><pub>Wiley Subscription Services, Inc., A Wiley Company</pub><doi>10.1002/pen.21633</doi><tpages>12</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0032-3888 |
| ispartof | Polymer engineering and science, 2010-06, Vol.50 (6), p.1128-1139 |
| issn | 0032-3888 1548-2634 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_753655503 |
| source | Wiley Online Library Journals Frontfile Complete |
| subjects | Adhesive strength Applied sciences Boundaries Chemical properties Composition Defects Dielectric films Drying Exact sciences and technology Film thickness Forms of application and semi-finished materials Mechanical properties Peeling Polyimide resins Polyimides Polymer industry, paints, wood Polymers Production processes Sheets and films Solvents Technology of polymers Thin films |
| title | Operating window for the peeling of polyimide film |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T22%3A44%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_proqu&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Operating%20window%20for%20the%20peeling%20of%20polyimide%20film&rft.jtitle=Polymer%20engineering%20and%20science&rft.au=Wang,%20Han-Yi&rft.date=2010-06&rft.volume=50&rft.issue=6&rft.spage=1128&rft.epage=1139&rft.pages=1128-1139&rft.issn=0032-3888&rft.eissn=1548-2634&rft.coden=PYESAZ&rft_id=info:doi/10.1002/pen.21633&rft_dat=%3Cgale_proqu%3EA229228834%3C/gale_proqu%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=366410130&rft_id=info:pmid/&rft_galeid=A229228834&rfr_iscdi=true |