Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

The interfacial reaction between SnAgCu and Ni is influenced by three important factors, namely, the Cu concentration in solder, solder volume, and temperature. In our previous studies, the first two factors had been investigated individually. In this study, the effects of these three factors are st...

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Veröffentlicht in:	Journal of alloys and compounds 2010-06, Vol.499 (2), p.149-153
Hauptverfasser:	Yang, S.C., Chang, C.C., Tsai, M.H., Kao, C.R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Applied sciences Brazing. Soldering Copper Diffusion Exact sciences and technology Interface reactions Intermetallic compounds Intermetallics Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Nickel Soldering Solders Spalling
Online-Zugang:	Volltext
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