Characterization and modeling of volumetric and mechanical properties for step and flash imprint lithography photopolymers

Step and flash imprint lithography (SFIL) is an alternative approach to high-resolution patterning based on a bilayer imprint scheme. SFIL utilizes the in situ photopolymerization of an oxygen etch resistant monomer solution in the topography of a template to replicate the template pattern on a substrate. The SFIL replication process can be affected significantly by the densification associated with polymerization and by the mechanical properties of the cured film. The densities of cured photopolymers were determined as a function of pendant group volume. The elastic moduli of several photopolymer samples were calculated based on a Hertzian fit to force–distance data generated by atomic force microscopy. The current SFIL photopolymer formulation undergoes a 9.3% (v/v) densification. The elastic modulus of the SFIL photopolymer is 4 MPa. The densification and the elastic modulus of the photopolymer layer can be tailored from 4% to 16%, and from 2 to 30 MPa, respectively, by changing the structure of the photopolymer precursors and their formulation. The complex interaction among densification, mechanical properties (elastic modulus and Poisson’s ratio) and aspect ratio (height:width) was studied by finite element modeling. The effect of these parameters on linewidth, sidewall angle, and image placement was modeled. The results indicate that the majority of densification occurs by shrinkage in the direction normal to the substrate surface and that Poisson’s ratio plays a critical role in defining the shape of the replicated features. Over the range of material properties that were determined experimentally, volumetric contraction of the photopolymer is not predicted to adversely affect either pattern placement or sidewall angle.