Jet impingement boiling of a dielectric coolant in narrow gaps

An experimental investigation into the effect of the chip-to-orifice gap was conducted for jet-impingement boiling of FC-72 at the back surface of a 6.5-mm square thermal chip on a 28-mm square ceramic substrate. Four different types of jets were used, all of them employing a single 0.50-mm diameter...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part A packaging, and manufacturing technology. Part A, 1995-09, Vol.18 (3), p.527-533
Hauptverfasser:	Chrysler, G.M., Chu, R.C., Simons, R.E.
Format:	Artikel
Sprache:	eng
Schlagworte:	Ceramic materials Ceramics Coolants Dielectric materials Dielectric substrates Heat flux Heat transfer Jets Microprocessor chips Orifices Pistons Semiconductor device measurement Testing Thermal conductivity Thermal degradation Thermal variables measurement
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!