Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration

Emerging 3-D multistrata system integration offers the capability for high density interstratum interconnects that have short lengths and low parasitics. However, 3-D integration is only one way to accomplish system integration and it must compete against established system integration options such...

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Veröffentlicht in:	IEEE transactions on very large scale integration (VLSI) systems 2010-03, Vol.18 (3), p.450-460
Hauptverfasser:	Alam, S.M., Jones, R.E., Pozder, S., Chatterjee, R., Rauf, S., Jain, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integration 3-D IO design Analytical models Applied sciences Bonding Copper Costs Design engineering Design. Technologies. Operation analysis. Testing Electric power generation Electronics Exact sciences and technology High density Integrated circuit interconnections Integrated circuits Intellectual property Joints Microconnect Packaging Performance analysis Reuse Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors System-on-a-chip system-on-a-chip (SoC) Systems integration through-silicon via (TSV) Through-silicon vias Very large scale integration Wafer bonding
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