Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate
The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engin...
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| Veröffentlicht in: | Journal of electronic materials 2009-01, Vol.38 (1), p.54-60 |
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| creator | Takaku, Yoshikazu Makino, Komei Watanabe, Keita Ohnuma, Ikuo Kainuma, Ryosuke Yamada, Yasushi Yagi, Yuji Nakagawa, Ikuo Atsumi, Takashi Ishida, Kiyohito |
| description | The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between −40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al
3
Ni
2
layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small. |
| doi_str_mv | 10.1007/s11664-008-0528-y |
| format | Article |
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3
Ni
2
layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-008-0528-y</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Condensed matter: structure, mechanical and thermal properties ; Electronics and Microelectronics ; Eutectics ; Exact sciences and technology ; High temperature ; Instrumentation ; Intermetallic compounds ; Joining, thermal cutting: metallurgical aspects ; Lead free solders ; Materials Science ; Metals. Metallurgy ; Optical and Electronic Materials ; Physics ; Solid State Physics ; Structure and morphology; thickness ; Substrates ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thermal cycling ; Thin film structure and morphology</subject><ispartof>Journal of electronic materials, 2009-01, Vol.38 (1), p.54-60</ispartof><rights>TMS 2008</rights><rights>2009 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Jan 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c443t-98d713f1c104a38153b569364829ba2e918bece8e1d0903b782eb721774f8e613</citedby><cites>FETCH-LOGICAL-c443t-98d713f1c104a38153b569364829ba2e918bece8e1d0903b782eb721774f8e613</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-008-0528-y$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-008-0528-y$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>309,310,314,778,782,787,788,23917,23918,25127,27911,27912,41475,42544,51306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21079246$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Takaku, Yoshikazu</creatorcontrib><creatorcontrib>Makino, Komei</creatorcontrib><creatorcontrib>Watanabe, Keita</creatorcontrib><creatorcontrib>Ohnuma, Ikuo</creatorcontrib><creatorcontrib>Kainuma, Ryosuke</creatorcontrib><creatorcontrib>Yamada, Yasushi</creatorcontrib><creatorcontrib>Yagi, Yuji</creatorcontrib><creatorcontrib>Nakagawa, Ikuo</creatorcontrib><creatorcontrib>Atsumi, Takashi</creatorcontrib><creatorcontrib>Ishida, Kiyohito</creatorcontrib><title>Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between −40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al
3
Ni
2
layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.</description><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Electronics and Microelectronics</subject><subject>Eutectics</subject><subject>Exact sciences and technology</subject><subject>High temperature</subject><subject>Instrumentation</subject><subject>Intermetallic compounds</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Lead free solders</subject><subject>Materials Science</subject><subject>Metals. Metallurgy</subject><subject>Optical and Electronic Materials</subject><subject>Physics</subject><subject>Solid State Physics</subject><subject>Structure and morphology; thickness</subject><subject>Substrates</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thermal cycling</subject><subject>Thin film structure and morphology</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kE1LxDAQhoMouK7-AG9FEE_RTJKm6VHFLxCFVUG8hDSdaqWbrkmL7L83y4qC4GkO87wvMw8h-8COgbHiJAIoJSljmrKca7rcIBPIpaCg1fMmmTChgOZc5NtkJ8Z3xiAHDRMyu_EDhsa61nbZDK0b2t5nFQ6fiD578fS0o2c2Yp1dt69v9BHnCwx2GANmD31XY4iZ9XV212YPYxWHtMJdstXYLuLe95ySp8uLx_Nrent_dXN-ekudlGKgpa4LEA04YNIKDbmoclUKJTUvK8uxBF2hQ41Qs5KJqtAcq4JDUchGowIxJUfr3kXoP0aMg5m30WHXWY_9GE0hRXpa5jqRB3_I934MPh1nOJNaJRcqQbCGXOhjDNiYRWjnNiwNMLNybNaOTXJsVo7NMmUOv4ttdLZrgvWujT9BDqwouVx18zUX08q_Yvg94P_yL2L8ilY</recordid><startdate>20090101</startdate><enddate>20090101</enddate><creator>Takaku, Yoshikazu</creator><creator>Makino, Komei</creator><creator>Watanabe, Keita</creator><creator>Ohnuma, Ikuo</creator><creator>Kainuma, Ryosuke</creator><creator>Yamada, Yasushi</creator><creator>Yagi, Yuji</creator><creator>Nakagawa, Ikuo</creator><creator>Atsumi, Takashi</creator><creator>Ishida, Kiyohito</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><scope>7QQ</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20090101</creationdate><title>Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate</title><author>Takaku, Yoshikazu ; Makino, Komei ; Watanabe, Keita ; Ohnuma, Ikuo ; Kainuma, Ryosuke ; Yamada, Yasushi ; Yagi, Yuji ; Nakagawa, Ikuo ; Atsumi, Takashi ; Ishida, Kiyohito</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c443t-98d713f1c104a38153b569364829ba2e918bece8e1d0903b782eb721774f8e613</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Applied sciences</topic><topic>Brazing. 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Metallurgy</topic><topic>Optical and Electronic Materials</topic><topic>Physics</topic><topic>Solid State Physics</topic><topic>Structure and morphology; thickness</topic><topic>Substrates</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thermal cycling</topic><topic>Thin film structure and morphology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Takaku, Yoshikazu</creatorcontrib><creatorcontrib>Makino, Komei</creatorcontrib><creatorcontrib>Watanabe, Keita</creatorcontrib><creatorcontrib>Ohnuma, Ikuo</creatorcontrib><creatorcontrib>Kainuma, Ryosuke</creatorcontrib><creatorcontrib>Yamada, Yasushi</creatorcontrib><creatorcontrib>Yagi, Yuji</creatorcontrib><creatorcontrib>Nakagawa, Ikuo</creatorcontrib><creatorcontrib>Atsumi, Takashi</creatorcontrib><creatorcontrib>Ishida, Kiyohito</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection (ProQuest)</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Ceramic Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Takaku, Yoshikazu</au><au>Makino, Komei</au><au>Watanabe, Keita</au><au>Ohnuma, Ikuo</au><au>Kainuma, Ryosuke</au><au>Yamada, Yasushi</au><au>Yagi, Yuji</au><au>Nakagawa, Ikuo</au><au>Atsumi, Takashi</au><au>Ishida, Kiyohito</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2009-01-01</date><risdate>2009</risdate><volume>38</volume><issue>1</issue><spage>54</spage><epage>60</epage><pages>54-60</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between −40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al
3
Ni
2
layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-008-0528-y</doi><tpages>7</tpages></addata></record> |
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| ispartof | Journal of electronic materials, 2009-01, Vol.38 (1), p.54-60 |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Electronics and Microelectronics Eutectics Exact sciences and technology High temperature Instrumentation Intermetallic compounds Joining, thermal cutting: metallurgical aspects Lead free solders Materials Science Metals. Metallurgy Optical and Electronic Materials Physics Solid State Physics Structure and morphology thickness Substrates Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermal cycling Thin film structure and morphology |
| title | Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate |
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