Morphology and chemical composition of Ag/Sn/Ag interconnections

The main goal of the present contribution was to describe morphology and chemical composition of the intermetallic phases, which were formed during diffusion soldering process of the silver using tin. The Ag₃Sn intermetallics is the main constituent of the joint after diffusion soldering at 235°C an...

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Veröffentlicht in:	Journal of microscopy (Oxford) 2010-03, Vol.237 (3), p.388-390
Hauptverfasser:	SKRZYNIARZ, P, WOJEWODA-BUDKA, J, WIERZBICKA-MIERNIK, A, ZIEBA, P
Format:	Artikel
Sprache:	eng
Schlagworte:	Ag-Sn diffusion soldering TEM
Online-Zugang:	Volltext
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