Method of measuring the spatial resolution of a photoresist

By analysis of the response of a high-contrast photoresist to sinusoidal illumination, generated interferometrically, one can extract a phenomenological modulation transfer function of the resist material, thereby characterizing its spatial resolution. Deep-ultraviolet interferometric lithography al...

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Veröffentlicht in:Optics letters 2002-10, Vol.27 (20), p.1776-1778
Hauptverfasser: Hoffnagle, J A, Hinsberg, W D, Sanchez, M I, Houle, F A
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container_title Optics letters
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creator Hoffnagle, J A
Hinsberg, W D
Sanchez, M I
Houle, F A
description By analysis of the response of a high-contrast photoresist to sinusoidal illumination, generated interferometrically, one can extract a phenomenological modulation transfer function of the resist material, thereby characterizing its spatial resolution. Deep-ultraviolet interferometric lithography allows the resist response to be quantified at length scales below 100 nm. As an example, the resolution (FWHM) of the commercial resist UVII-HS is found to be approximately 50 nm. This simple method can be applied to materials under development for advanced photolithography with short-wavelength illumination.
doi_str_mv 10.1364/ol.27.001776
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title Method of measuring the spatial resolution of a photoresist
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