Mechanisms of Atomic Layer Deposition on Substrates with Ultrahigh Aspect Ratios

Mechanisms of Atomic Layer Deposition on Substrates with Ultrahigh Aspect Ratios

Atomic layer deposition (ALD) appears to be uniquely suited for coating substrates with ultrahigh aspect ratios (≳103), including nanoporous solids. Here, we study the ALD of Cu and Cu3N on the inner surfaces of low-density nanoporous silica aerogel monoliths. Results show that Cu depth profiles in...

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Veröffentlicht in:Langmuir 2008-02, Vol.24 (3), p.943-948
Hauptverfasser: Kucheyev, S. O, Biener, J, Baumann, T. F, Wang, Y. M, Hamza, A. V, Li, Z, Lee, D. K, Gordon, R. G
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Chemistry
Colloidal state and disperse state
Exact sciences and technology
General and physical chemistry
Porous materials
Surface physical chemistry
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container_end_page 948
container_issue 3
container_start_page 943
container_title Langmuir
container_volume 24
creator Kucheyev, S. O
Biener, J
Baumann, T. F
Wang, Y. M
Hamza, A. V
Li, Z
Lee, D. K
Gordon, R. G
description Atomic layer deposition (ALD) appears to be uniquely suited for coating substrates with ultrahigh aspect ratios (≳103), including nanoporous solids. Here, we study the ALD of Cu and Cu3N on the inner surfaces of low-density nanoporous silica aerogel monoliths. Results show that Cu depth profiles in nanoporous monoliths are limited not only by Knudsen diffusion of heavier precursor molecules into the pores, as currently believed, but also by other processes such as the interaction of precursor and reaction product molecules with pore walls. Similar behavior has also been observed for Fe, Ru, and Pt ALD on aerogels. On the basis of these results, we discuss design rules for ALD precursors specifically geared for coating nanoporous solids.
doi_str_mv 10.1021/la7018617
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subjects Chemistry
Colloidal state and disperse state
Exact sciences and technology
General and physical chemistry
Porous materials
Surface physical chemistry
title Mechanisms of Atomic Layer Deposition on Substrates with Ultrahigh Aspect Ratios
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