Dynamics of a bonding front
A description of the bonding front propagation between two adhesive plates is proposed. The model relates the velocity of a bonding front to the adhesion energy, with application to wafer direct bonding. Its derivation is based on a competition between the bonding energy and the viscous drag of the...
Gespeichert in:
| Veröffentlicht in: | Physical review letters 2005-06, Vol.94 (23), p.236101.1-236101.4, Article 236101 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 236101.4 |
|---|---|
| container_issue | 23 |
| container_start_page | 236101.1 |
| container_title | Physical review letters |
| container_volume | 94 |
| creator | RIEUTORD, F BATAILLOU, B MORICEAU, H |
| description | A description of the bonding front propagation between two adhesive plates is proposed. The model relates the velocity of a bonding front to the adhesion energy, with application to wafer direct bonding. Its derivation is based on a competition between the bonding energy and the viscous drag of the air flow in the gap between the two wafers. The model describes well the experimental data, including the wafer deformation profile during bonding or the dependence of the velocity on the gas viscosity, pressure, and wafer thickness. |
| doi_str_mv | 10.1103/PhysRevLett.94.236101 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_68463751</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>68463751</sourcerecordid><originalsourceid>FETCH-LOGICAL-c337t-8ef5c9910ca2644daefde39881f1a9ae77b607341d6a4bddf31a1043657e27ec3</originalsourceid><addsrcrecordid>eNpNkEtLAzEUhYMotlZ_gSiz0d3UeyeZPJZSn1BQRNchk4eOzEOTqdB_b6UDdnU23zkHPkLOEOaIQK-eP9bpxf8s_TDMFZsXlCPgHpkiCJULRLZPpgAUcwUgJuQopU8AwILLQzJBDgqYZFNyerPuTFvblPUhM1nVd67u3rMQ-244JgfBNMmfjDkjb3e3r4uHfPl0_7i4XuaWUjHk0ofSKoVgTcEZc8YH56mSEgMaZbwQFQdBGTpuWOVcoGgQGOWl8IXwls7I5Xb3K_bfK58G3dbJ-qYxne9XSXPJOBUlbsByC9rYpxR90F-xbk1cawT9Z0XvWNGK6a2VTe98PFhVrXf_rVHDBrgYAZOsaUI0na3TDqcKJVVBfwGY62wO</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>68463751</pqid></control><display><type>article</type><title>Dynamics of a bonding front</title><source>MEDLINE</source><source>American Physical Society Journals</source><creator>RIEUTORD, F ; BATAILLOU, B ; MORICEAU, H</creator><creatorcontrib>RIEUTORD, F ; BATAILLOU, B ; MORICEAU, H</creatorcontrib><description>A description of the bonding front propagation between two adhesive plates is proposed. The model relates the velocity of a bonding front to the adhesion energy, with application to wafer direct bonding. Its derivation is based on a competition between the bonding energy and the viscous drag of the air flow in the gap between the two wafers. The model describes well the experimental data, including the wafer deformation profile during bonding or the dependence of the velocity on the gas viscosity, pressure, and wafer thickness.</description><identifier>ISSN: 0031-9007</identifier><identifier>EISSN: 1079-7114</identifier><identifier>DOI: 10.1103/PhysRevLett.94.236101</identifier><identifier>PMID: 16090484</identifier><identifier>CODEN: PRLTAO</identifier><language>eng</language><publisher>Ridge, NY: American Physical Society</publisher><subject>Cell Adhesion ; Condensed matter: structure, mechanical and thermal properties ; Elasticity ; Exact sciences and technology ; Models, Theoretical ; Physics ; Silicon - chemistry ; Solid-fluid interfaces ; Surface Properties ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thermodynamics ; Tissue Adhesions ; Viscosity ; Wetting</subject><ispartof>Physical review letters, 2005-06, Vol.94 (23), p.236101.1-236101.4, Article 236101</ispartof><rights>2007 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c337t-8ef5c9910ca2644daefde39881f1a9ae77b607341d6a4bddf31a1043657e27ec3</citedby><cites>FETCH-LOGICAL-c337t-8ef5c9910ca2644daefde39881f1a9ae77b607341d6a4bddf31a1043657e27ec3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,2863,2864,27901,27902</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16929892$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/16090484$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>RIEUTORD, F</creatorcontrib><creatorcontrib>BATAILLOU, B</creatorcontrib><creatorcontrib>MORICEAU, H</creatorcontrib><title>Dynamics of a bonding front</title><title>Physical review letters</title><addtitle>Phys Rev Lett</addtitle><description>A description of the bonding front propagation between two adhesive plates is proposed. The model relates the velocity of a bonding front to the adhesion energy, with application to wafer direct bonding. Its derivation is based on a competition between the bonding energy and the viscous drag of the air flow in the gap between the two wafers. The model describes well the experimental data, including the wafer deformation profile during bonding or the dependence of the velocity on the gas viscosity, pressure, and wafer thickness.</description><subject>Cell Adhesion</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Elasticity</subject><subject>Exact sciences and technology</subject><subject>Models, Theoretical</subject><subject>Physics</subject><subject>Silicon - chemistry</subject><subject>Solid-fluid interfaces</subject><subject>Surface Properties</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thermodynamics</subject><subject>Tissue Adhesions</subject><subject>Viscosity</subject><subject>Wetting</subject><issn>0031-9007</issn><issn>1079-7114</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>EIF</sourceid><recordid>eNpNkEtLAzEUhYMotlZ_gSiz0d3UeyeZPJZSn1BQRNchk4eOzEOTqdB_b6UDdnU23zkHPkLOEOaIQK-eP9bpxf8s_TDMFZsXlCPgHpkiCJULRLZPpgAUcwUgJuQopU8AwILLQzJBDgqYZFNyerPuTFvblPUhM1nVd67u3rMQ-244JgfBNMmfjDkjb3e3r4uHfPl0_7i4XuaWUjHk0ofSKoVgTcEZc8YH56mSEgMaZbwQFQdBGTpuWOVcoGgQGOWl8IXwls7I5Xb3K_bfK58G3dbJ-qYxne9XSXPJOBUlbsByC9rYpxR90F-xbk1cawT9Z0XvWNGK6a2VTe98PFhVrXf_rVHDBrgYAZOsaUI0na3TDqcKJVVBfwGY62wO</recordid><startdate>20050617</startdate><enddate>20050617</enddate><creator>RIEUTORD, F</creator><creator>BATAILLOU, B</creator><creator>MORICEAU, H</creator><general>American Physical Society</general><scope>IQODW</scope><scope>CGR</scope><scope>CUY</scope><scope>CVF</scope><scope>ECM</scope><scope>EIF</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope></search><sort><creationdate>20050617</creationdate><title>Dynamics of a bonding front</title><author>RIEUTORD, F ; BATAILLOU, B ; MORICEAU, H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c337t-8ef5c9910ca2644daefde39881f1a9ae77b607341d6a4bddf31a1043657e27ec3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Cell Adhesion</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Elasticity</topic><topic>Exact sciences and technology</topic><topic>Models, Theoretical</topic><topic>Physics</topic><topic>Silicon - chemistry</topic><topic>Solid-fluid interfaces</topic><topic>Surface Properties</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thermodynamics</topic><topic>Tissue Adhesions</topic><topic>Viscosity</topic><topic>Wetting</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>RIEUTORD, F</creatorcontrib><creatorcontrib>BATAILLOU, B</creatorcontrib><creatorcontrib>MORICEAU, H</creatorcontrib><collection>Pascal-Francis</collection><collection>Medline</collection><collection>MEDLINE</collection><collection>MEDLINE (Ovid)</collection><collection>MEDLINE</collection><collection>MEDLINE</collection><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><jtitle>Physical review letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>RIEUTORD, F</au><au>BATAILLOU, B</au><au>MORICEAU, H</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dynamics of a bonding front</atitle><jtitle>Physical review letters</jtitle><addtitle>Phys Rev Lett</addtitle><date>2005-06-17</date><risdate>2005</risdate><volume>94</volume><issue>23</issue><spage>236101.1</spage><epage>236101.4</epage><pages>236101.1-236101.4</pages><artnum>236101</artnum><issn>0031-9007</issn><eissn>1079-7114</eissn><coden>PRLTAO</coden><abstract>A description of the bonding front propagation between two adhesive plates is proposed. The model relates the velocity of a bonding front to the adhesion energy, with application to wafer direct bonding. Its derivation is based on a competition between the bonding energy and the viscous drag of the air flow in the gap between the two wafers. The model describes well the experimental data, including the wafer deformation profile during bonding or the dependence of the velocity on the gas viscosity, pressure, and wafer thickness.</abstract><cop>Ridge, NY</cop><pub>American Physical Society</pub><pmid>16090484</pmid><doi>10.1103/PhysRevLett.94.236101</doi><tpages>1</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0031-9007 |
| ispartof | Physical review letters, 2005-06, Vol.94 (23), p.236101.1-236101.4, Article 236101 |
| issn | 0031-9007 1079-7114 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_68463751 |
| source | MEDLINE; American Physical Society Journals |
| subjects | Cell Adhesion Condensed matter: structure, mechanical and thermal properties Elasticity Exact sciences and technology Models, Theoretical Physics Silicon - chemistry Solid-fluid interfaces Surface Properties Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermodynamics Tissue Adhesions Viscosity Wetting |
| title | Dynamics of a bonding front |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T18%3A28%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Dynamics%20of%20a%20bonding%20front&rft.jtitle=Physical%20review%20letters&rft.au=RIEUTORD,%20F&rft.date=2005-06-17&rft.volume=94&rft.issue=23&rft.spage=236101.1&rft.epage=236101.4&rft.pages=236101.1-236101.4&rft.artnum=236101&rft.issn=0031-9007&rft.eissn=1079-7114&rft.coden=PRLTAO&rft_id=info:doi/10.1103/PhysRevLett.94.236101&rft_dat=%3Cproquest_cross%3E68463751%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=68463751&rft_id=info:pmid/16090484&rfr_iscdi=true |