Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures
Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile...
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| Veröffentlicht in: | Small (Weinheim an der Bergstrasse, Germany) Germany), 2007-10, Vol.3 (10), p.1703-1706 |
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| container_end_page | 1706 |
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| container_issue | 10 |
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| container_title | Small (Weinheim an der Bergstrasse, Germany) |
| container_volume | 3 |
| creator | Hagberg, Erik C. Scott, J. Campbell Shaw, Justine A. von Werne, Timothy A. Maegerlein, Janet A. Carter, Kenneth R. |
| description | Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions. |
| doi_str_mv | 10.1002/smll.200700343 |
| format | Article |
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| fulltext | fulltext |
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| ispartof | Small (Weinheim an der Bergstrasse, Germany), 2007-10, Vol.3 (10), p.1703-1706 |
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| language | eng |
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| source | MEDLINE; Wiley Online Library Journals Frontfile Complete |
| subjects | Copper - chemistry electroless plating Metal Nanoparticles - chemistry Microscopy, Atomic Force Microscopy, Electron, Scanning nanoimprint lithography Nanotechnology - methods patterning Polymers - chemistry surface functionalization |
| title | Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures |
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