Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationi...

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Veröffentlicht in:	Journal of hazardous materials 2005-04, Vol.120 (1), p.15-20
Hauptverfasser:	Hu, C.Y., Lo, S.L., Li, C.M., Kuan, W.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cetrimonium Compounds - chemistry Chemical engineering Chemical mechanical polishing wastewater Computers Electro-coagulation-flotation process Electrochemistry Electronics Exact sciences and technology Flotation General purification processes Liquid-liquid and fluid-solid mechanical separations Manufactured Materials Pollution Settling Sodium Dodecyl Sulfate - chemistry Solid-solid systems Surface-Active Agents - chemistry Surfactant Waste Disposal, Fluid - methods Wastewaters Water treatment and pollution
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