Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead
Lead drops exhibit partial wetting on some substrates and pseudopartial wetting on others. In pseudopartial wetting, a film is in equilibrium with a capillary body with a nonzero contact angle. Using a free energy formulation appropriate for the experiments, we show the conditions under which minimi...
Gespeichert in:
Veröffentlicht in: | Langmuir 2004-03, Vol.20 (7), p.2726-2729 |
---|---|
Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 2729 |
---|---|
container_issue | 7 |
container_start_page | 2726 |
container_title | Langmuir |
container_volume | 20 |
creator | Humfeld, Keith D Garoff, Stephen Wynblatt, Paul |
description | Lead drops exhibit partial wetting on some substrates and pseudopartial wetting on others. In pseudopartial wetting, a film is in equilibrium with a capillary body with a nonzero contact angle. Using a free energy formulation appropriate for the experiments, we show the conditions under which minimization of the system energy is accurately achieved by minimizing the energy of the film alone. Using a set of simple surface energy isotherms, we explain the various wetting behaviors of lead. We contrast isotherms for autophobing systems and the metallic systems considered here. |
doi_str_mv | 10.1021/la035759d |
format | Article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_67273228</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>67273228</sourcerecordid><originalsourceid>FETCH-LOGICAL-a349t-69758eddce7c61e0930f2d4050b27a076a2497ada1d1556d8da23ccf3959063d3</originalsourceid><addsrcrecordid>eNpt0E9LwzAYBvAgipvTg19AelHwUM2fpmmPMtSpEwub8xjeNql0dutMUnDf3oyWefGUF_LjfV4ehM4JviGYktsaMOOCp-oADQmnOOQJFYdoiEXEQhHFbIBOrF1ijFMWpcdoQHjCOImiIXq5W0O9tZUNmjLIrG5VswHjKqgDWKsg6-cP7Vy1_tyhBZiqaW0wa3PrDDhtg3wbTDWoU3RUQm31Wf-O0PvD_Xw8Cadvj0_ju2kIPt2FcSp4opUqtChiov1NuKQqwhznVAAWMdAoFaCAKMJ5rBIFlBVFyVKe4pgpNkJX3d6Nab5bbZ1cVbbQdQ1r7S-TsaCCUZp4eN3BwjTWGl3KjalWYLaSYLlrTu6b8_aiX9rmK63-ZF-VB2EHKuv0z_4fzJcPZILLeTaT-DmbLJLXVI69v-w8FFYum9b4ou0_wb8muIM8</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>67273228</pqid></control><display><type>article</type><title>Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead</title><source>American Chemical Society Journals</source><creator>Humfeld, Keith D ; Garoff, Stephen ; Wynblatt, Paul</creator><creatorcontrib>Humfeld, Keith D ; Garoff, Stephen ; Wynblatt, Paul</creatorcontrib><description>Lead drops exhibit partial wetting on some substrates and pseudopartial wetting on others. In pseudopartial wetting, a film is in equilibrium with a capillary body with a nonzero contact angle. Using a free energy formulation appropriate for the experiments, we show the conditions under which minimization of the system energy is accurately achieved by minimizing the energy of the film alone. Using a set of simple surface energy isotherms, we explain the various wetting behaviors of lead. We contrast isotherms for autophobing systems and the metallic systems considered here.</description><identifier>ISSN: 0743-7463</identifier><identifier>EISSN: 1520-5827</identifier><identifier>DOI: 10.1021/la035759d</identifier><identifier>PMID: 15835144</identifier><language>eng</language><publisher>United States: American Chemical Society</publisher><ispartof>Langmuir, 2004-03, Vol.20 (7), p.2726-2729</ispartof><rights>Copyright © 2004 American Chemical Society</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a349t-69758eddce7c61e0930f2d4050b27a076a2497ada1d1556d8da23ccf3959063d3</citedby><cites>FETCH-LOGICAL-a349t-69758eddce7c61e0930f2d4050b27a076a2497ada1d1556d8da23ccf3959063d3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://pubs.acs.org/doi/pdf/10.1021/la035759d$$EPDF$$P50$$Gacs$$H</linktopdf><linktohtml>$$Uhttps://pubs.acs.org/doi/10.1021/la035759d$$EHTML$$P50$$Gacs$$H</linktohtml><link.rule.ids>314,780,784,2765,27076,27924,27925,56738,56788</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/15835144$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Humfeld, Keith D</creatorcontrib><creatorcontrib>Garoff, Stephen</creatorcontrib><creatorcontrib>Wynblatt, Paul</creatorcontrib><title>Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead</title><title>Langmuir</title><addtitle>Langmuir</addtitle><description>Lead drops exhibit partial wetting on some substrates and pseudopartial wetting on others. In pseudopartial wetting, a film is in equilibrium with a capillary body with a nonzero contact angle. Using a free energy formulation appropriate for the experiments, we show the conditions under which minimization of the system energy is accurately achieved by minimizing the energy of the film alone. Using a set of simple surface energy isotherms, we explain the various wetting behaviors of lead. We contrast isotherms for autophobing systems and the metallic systems considered here.</description><issn>0743-7463</issn><issn>1520-5827</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNpt0E9LwzAYBvAgipvTg19AelHwUM2fpmmPMtSpEwub8xjeNql0dutMUnDf3oyWefGUF_LjfV4ehM4JviGYktsaMOOCp-oADQmnOOQJFYdoiEXEQhHFbIBOrF1ijFMWpcdoQHjCOImiIXq5W0O9tZUNmjLIrG5VswHjKqgDWKsg6-cP7Vy1_tyhBZiqaW0wa3PrDDhtg3wbTDWoU3RUQm31Wf-O0PvD_Xw8Cadvj0_ju2kIPt2FcSp4opUqtChiov1NuKQqwhznVAAWMdAoFaCAKMJ5rBIFlBVFyVKe4pgpNkJX3d6Nab5bbZ1cVbbQdQ1r7S-TsaCCUZp4eN3BwjTWGl3KjalWYLaSYLlrTu6b8_aiX9rmK63-ZF-VB2EHKuv0z_4fzJcPZILLeTaT-DmbLJLXVI69v-w8FFYum9b4ou0_wb8muIM8</recordid><startdate>20040330</startdate><enddate>20040330</enddate><creator>Humfeld, Keith D</creator><creator>Garoff, Stephen</creator><creator>Wynblatt, Paul</creator><general>American Chemical Society</general><scope>BSCLL</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope></search><sort><creationdate>20040330</creationdate><title>Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead</title><author>Humfeld, Keith D ; Garoff, Stephen ; Wynblatt, Paul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a349t-69758eddce7c61e0930f2d4050b27a076a2497ada1d1556d8da23ccf3959063d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Humfeld, Keith D</creatorcontrib><creatorcontrib>Garoff, Stephen</creatorcontrib><creatorcontrib>Wynblatt, Paul</creatorcontrib><collection>Istex</collection><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><jtitle>Langmuir</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Humfeld, Keith D</au><au>Garoff, Stephen</au><au>Wynblatt, Paul</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead</atitle><jtitle>Langmuir</jtitle><addtitle>Langmuir</addtitle><date>2004-03-30</date><risdate>2004</risdate><volume>20</volume><issue>7</issue><spage>2726</spage><epage>2729</epage><pages>2726-2729</pages><issn>0743-7463</issn><eissn>1520-5827</eissn><abstract>Lead drops exhibit partial wetting on some substrates and pseudopartial wetting on others. In pseudopartial wetting, a film is in equilibrium with a capillary body with a nonzero contact angle. Using a free energy formulation appropriate for the experiments, we show the conditions under which minimization of the system energy is accurately achieved by minimizing the energy of the film alone. Using a set of simple surface energy isotherms, we explain the various wetting behaviors of lead. We contrast isotherms for autophobing systems and the metallic systems considered here.</abstract><cop>United States</cop><pub>American Chemical Society</pub><pmid>15835144</pmid><doi>10.1021/la035759d</doi><tpages>4</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0743-7463 |
ispartof | Langmuir, 2004-03, Vol.20 (7), p.2726-2729 |
issn | 0743-7463 1520-5827 |
language | eng |
recordid | cdi_proquest_miscellaneous_67273228 |
source | American Chemical Society Journals |
title | Analysis of Pseudopartial and Partial Wetting of Various Substrates by Lead |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T12%3A51%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Analysis%20of%20Pseudopartial%20and%20Partial%20Wetting%20of%20Various%20Substrates%20by%20Lead&rft.jtitle=Langmuir&rft.au=Humfeld,%20Keith%20D&rft.date=2004-03-30&rft.volume=20&rft.issue=7&rft.spage=2726&rft.epage=2729&rft.pages=2726-2729&rft.issn=0743-7463&rft.eissn=1520-5827&rft_id=info:doi/10.1021/la035759d&rft_dat=%3Cproquest_cross%3E67273228%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=67273228&rft_id=info:pmid/15835144&rfr_iscdi=true |