Fabrication of submicrometer periodic structures using Interference lithography and two-layer chalcogenide photoresist

Technological process of interference lithography using two-layer chalcogenide photoresist were investigated. Top As(40)S(30)Se(30) layer is photoresist with a high selectivity and can be used for recording of interference pattern and formation of first lithographic mask. Second, more thick As(4)Ge(30)Se(66) layer, almost is not sensitive to light, but dissolves in weak (0.05%) water solution of KOH. That, optimizing the etchant solutions for both layers, exposure and time of etching it is possible to carry out the technological process of formation of the lithographic mask with high modulation and with the groove form close to rectangular. This technology has been used for the fabrication of one- and two-dimensional periodic structures. Using two-layer As(40)S(30)Se30()-As(4)Ge(30)S(66) photoresist, we have fabricated the diffraction gratings and two-dimensional periodic structures with elements of submicron size. Relief parameters and diffractions properties of the obtained structures md their dependence on etching time are studied.