Powder Priming of SMC. Part II: Failure Mechanism

Current sheet molding compound (SMC) panels, when coated with powder primer, show primer popping in the bake oven due to the degassing of the substrate moisture. In the absence of moisture, however, it was found that some SMCs showed severe popping, while other SMC materials did not. These results s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of composite materials 2006-08, Vol.40 (16), p.1431-1447
Hauptverfasser:	Kia, Hamid G., Shah, Bhavesh, Wathen, Terrence J., Mitchell, Harry A., Berger, Christina R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Exact sciences and technology Fracture mechanics (crack, fatigue, damage...) Fundamental areas of phenomenology (including applications) Heat conduction Heat transfer Machinery and processing Miscellaneous Moulding Physics Plastics Polymer industry, paints, wood Solid mechanics Structural and continuum mechanics Technology of polymers
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!