“Microflex”—A New Assembling Technique for Interconnects

A new interconnection technique has been developed that allows versatile multiple strand connections between microsensors, sensor arrays, and chips designed for wire bonding. The new technique has been termed “Microflex interconnection” technique (MFI). Conventional wire bonding technique is commonl...

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Veröffentlicht in:	Journal of intelligent material systems and structures 2000-06, Vol.11 (6), p.417-425
Hauptverfasser:	Stieglitz, Thomas, Beutel, Hansjoerg, Meyer, J. -Uwe
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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