Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards
Nonconductive films (NCFs) are one of the polymer interconnect materials for flip-chip interconnection. NCFs containing no conductive particles play several roles such as adhesion, insulation, and underfilling at the same time. The most important issue of NCF flip-chip-on-board (FCOB) assemblies is...
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Veröffentlicht in: | IEEE transactions on components and packaging technologies 2007-09, Vol.30 (3), p.464-471 |
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