Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Nonconductive films (NCFs) are one of the polymer interconnect materials for flip-chip interconnection. NCFs containing no conductive particles play several roles such as adhesion, insulation, and underfilling at the same time. The most important issue of NCF flip-chip-on-board (FCOB) assemblies is...

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Veröffentlicht in:IEEE transactions on components and packaging technologies 2007-09, Vol.30 (3), p.464-471
Hauptverfasser: Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook
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Sprache:eng
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