Assembly and Reliability of Very Large Flip-chip on CQFP

The IBM ceramic quad flat pack (CQFP) is a high performance, low-cost chip carrier for surface mount assembly. It is an extension of metallised ceramic (MC) and metallised ceramic with polyimide (MCP) product technologies. These finished modules conform to JEDEC I O and footprint standards. They are...

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Bibliographische Detailangaben

Veröffentlicht in:	Microelectronics international 1996-08, Vol.13 (2), p.5-8
Hauptverfasser:	Clementi, J.J, Dearing, G.0, Bergeron, C
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Experiments Lead Microelectronics Packaging Semiconductors Surface mount technology Thermal cycling
Online-Zugang:	Volltext
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