Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system
In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent expe...
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| Veröffentlicht in: | Journal of electronic materials 2007-02, Vol.36 (2), p.136-146 |
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| creator | YU, H VUORINEN, V KIVILAHTI, J. K |
| description | In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)^sub 6^Sn^sub 5^ formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu^sub 6^Sn^sub 5^ compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)^sub 6^Sn^sub 5^ and (Cu,Ni)^sub 3^Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems. [PUBLICATION ABSTRACT] |
| doi_str_mv | 10.1007/s11664-006-0028-x |
| format | Article |
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K</creator><creatorcontrib>YU, H ; VUORINEN, V ; KIVILAHTI, J. K</creatorcontrib><description>In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)^sub 6^Sn^sub 5^ formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu^sub 6^Sn^sub 5^ compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)^sub 6^Sn^sub 5^ and (Cu,Ni)^sub 3^Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems. 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K</creatorcontrib><title>Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system</title><title>Journal of electronic materials</title><description>In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)^sub 6^Sn^sub 5^ formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu^sub 6^Sn^sub 5^ compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)^sub 6^Sn^sub 5^ and (Cu,Ni)^sub 3^Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems. [PUBLICATION ABSTRACT]</description><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Interconnect</subject><subject>Intermetallic compounds</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system</atitle><jtitle>Journal of electronic materials</jtitle><date>2007-02-01</date><risdate>2007</risdate><volume>36</volume><issue>2</issue><spage>136</spage><epage>146</epage><pages>136-146</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)^sub 6^Sn^sub 5^ formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu^sub 6^Sn^sub 5^ compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)^sub 6^Sn^sub 5^ and (Cu,Ni)^sub 3^Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems. [PUBLICATION ABSTRACT]</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-006-0028-x</doi><tpages>11</tpages></addata></record> |
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| subjects | Applied sciences Condensed matter: structure, mechanical and thermal properties Electronics Exact sciences and technology Interconnect Intermetallic compounds Microelectronic fabrication (materials and surfaces technology) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Structure and morphology thickness Studies Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermodynamics Thin film structure and morphology |
| title | Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system |
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