Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In this paper, the propagation of delamination in a nanofilled no-flow underfill material from the chip passiva...

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Veröffentlicht in:	Journal of electronic packaging 2008-12, Vol.130 (4), p.041005 (5 )-041005 (5 )
Hauptverfasser:	Mahalingam, Saketh, Prabhakumar, Ananth, Tonapi, Sandeep, Sitaraman, Suresh K
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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