Switching Performance of Epitaxially Grown Normally-Off 4H-SiC JFET

Static and dynamic behavior of the epitaxially grown dual gate trench 4H-SiC junction field effect transistor (JFET) is investigated. Typical on-state resistance Ron was 6 – 10mΩcm2 at VGS = 2.5V and the breakdown voltage between the range of 1.5 – 1.8kV was realized at VGS = −5V for normally-off li...

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Veröffentlicht in:Materials science forum 2009-01, Vol.600-603, p.1067-1070
Hauptverfasser: Takeuchi, Yuuichi, Sugiyama, Naohiro, Malhan, Rajesh Kumar, Rashid, S.J., Amaratunga, G.A.J., Reimann, T., Udrea, F., Kataoka, Mitsuhiro
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container_title Materials science forum
container_volume 600-603
creator Takeuchi, Yuuichi
Sugiyama, Naohiro
Malhan, Rajesh Kumar
Rashid, S.J.
Amaratunga, G.A.J.
Reimann, T.
Udrea, F.
Kataoka, Mitsuhiro
description Static and dynamic behavior of the epitaxially grown dual gate trench 4H-SiC junction field effect transistor (JFET) is investigated. Typical on-state resistance Ron was 6 – 10mΩcm2 at VGS = 2.5V and the breakdown voltage between the range of 1.5 – 1.8kV was realized at VGS = −5V for normally-off like JFETs. It was found that the turn-on energy delivers the biggest part of the switching losses. The dependence of switching losses from gate resistor is nearly linear, suggesting that changing the gate resistor, a way similar to Si-IGBT technology, can easily control di/dt and dv/dt. Turn-on losses at 200°C are lower compared to those at 25°C, which indicates the influence of the high internal p-type gate layer resistance. Inductive switching numerical analysis suggested the strong influence of channel doping conditions on the turn-on switching performance. The fast switching normally-off JFET devices require heavily doped narrow JFET channel design.
doi_str_mv 10.4028/www.scientific.net/MSF.600-603.1067
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