Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates

The present work was carried out in the framework of the study of new lead-free solder alloys for technical applications in electronic devices. In the focus of this characterisation the wetting behaviour of several Sn-rich alloys belonging to the In–Sn, Au–Sn and Cu–Sn systems has been studied by me...

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Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2008-11, Vol.495 (1), p.108-112
Hauptverfasser:	Amore, S., Ricci, E., Borzone, G., Novakovic, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Interface Intermetallics Lead-free solders Physics Reactivity Solid-fluid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Wetting
Online-Zugang:	Volltext
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