Effect of copper addition and heat treatment on the depth dependence of the nanoindentation creep of aluminum at 300 K
Constant-load indentation creep tests were performed on pure aluminum and aluminum 4 wt% copper at 300 K to assess the influence of indentation depth, copper addition, and heat treatment upon the indentation creep rate. The stress dependence of the average indentation creep rate could be expressed f...
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| Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2009-01, Vol.500 (1), p.164-169 |
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| container_title | Materials science & engineering. A, Structural materials : properties, microstructure and processing |
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| creator | Bose, Bipasha Klassen, R.J. |
| description | Constant-load indentation creep tests were performed on pure aluminum and aluminum 4
wt% copper at 300
K to assess the influence of indentation depth, copper addition, and heat treatment upon the indentation creep rate. The stress dependence of the average indentation creep rate could be expressed for all the samples tested in terms of a mechanism of obstacle-limited dislocation glide. The calculated activation energy showed the same dependence upon indentation stress for all the conditions investigated.
We therefore conclude that the indentation creep rate is limited by dislocation/dislocation interactions regardless of indentation depth, copper addition, or heat treatment. The presence of 4
wt% copper and heat treatment, however changes, the dislocation density, and hence the spacing of the dislocation–dislocation interactions. |
| doi_str_mv | 10.1016/j.msea.2008.09.018 |
| format | Article |
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wt% copper at 300
K to assess the influence of indentation depth, copper addition, and heat treatment upon the indentation creep rate. The stress dependence of the average indentation creep rate could be expressed for all the samples tested in terms of a mechanism of obstacle-limited dislocation glide. The calculated activation energy showed the same dependence upon indentation stress for all the conditions investigated.
We therefore conclude that the indentation creep rate is limited by dislocation/dislocation interactions regardless of indentation depth, copper addition, or heat treatment. The presence of 4
wt% copper and heat treatment, however changes, the dislocation density, and hence the spacing of the dislocation–dislocation interactions.</description><identifier>ISSN: 0921-5093</identifier><identifier>EISSN: 1873-4936</identifier><identifier>DOI: 10.1016/j.msea.2008.09.018</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Aluminum ; Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Creep ; Exact sciences and technology ; Heat treatment ; Mechanical and acoustical properties of condensed matter ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Mechanical properties of solids ; Metals. Metallurgy ; Nanoindentation ; Physics</subject><ispartof>Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2009-01, Vol.500 (1), p.164-169</ispartof><rights>2008 Elsevier B.V.</rights><rights>2009 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.msea.2008.09.018$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3536,27903,27904,45974</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20980411$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Bose, Bipasha</creatorcontrib><creatorcontrib>Klassen, R.J.</creatorcontrib><title>Effect of copper addition and heat treatment on the depth dependence of the nanoindentation creep of aluminum at 300 K</title><title>Materials science & engineering. A, Structural materials : properties, microstructure and processing</title><description>Constant-load indentation creep tests were performed on pure aluminum and aluminum 4
wt% copper at 300
K to assess the influence of indentation depth, copper addition, and heat treatment upon the indentation creep rate. The stress dependence of the average indentation creep rate could be expressed for all the samples tested in terms of a mechanism of obstacle-limited dislocation glide. The calculated activation energy showed the same dependence upon indentation stress for all the conditions investigated.
We therefore conclude that the indentation creep rate is limited by dislocation/dislocation interactions regardless of indentation depth, copper addition, or heat treatment. The presence of 4
wt% copper and heat treatment, however changes, the dislocation density, and hence the spacing of the dislocation–dislocation interactions.</description><subject>Aluminum</subject><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Creep</subject><subject>Exact sciences and technology</subject><subject>Heat treatment</subject><subject>Mechanical and acoustical properties of condensed matter</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Mechanical properties of solids</subject><subject>Metals. Metallurgy</subject><subject>Nanoindentation</subject><subject>Physics</subject><issn>0921-5093</issn><issn>1873-4936</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNotkU9v1DAQxS1EJZaWL8DJF7gljP8kjqVeUNUCohIXOFuz9kTrVeKktrcS356E9jIjzfzmafQeYx8FtAJE_-XczoWwlQBDC7YFMbxhBzEY1Wir-rfsAFaKpgOr3rH3pZwBQGjoDuz5fhzJV76M3C_rSpljCLHGJXFMgZ8IK695qzOljUq8nogHWutpr5QCJU_79T5PmJa4jyr-V_CZaN2XOF3mmC4z39QUAP95w65GnAp9eO3X7M_D_e-7783jr28_7r4-NiR7W5s-GBGCQYt4PMqu936UfadGY4ag1KDJe6vRGyF0H1CiEsNRG6kkaJAGpbpmn19017w8XahUN8fiaZow0XIpTnXKaAv9Bn56BbF4nMaMycfi1hxnzH-dBDuAFmLjbl842r5-jpRd8XH3IMS8-ejCEp0At4fizm4Pxe2hOLBuC0X9A0prgZo</recordid><startdate>20090125</startdate><enddate>20090125</enddate><creator>Bose, Bipasha</creator><creator>Klassen, R.J.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>7QF</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20090125</creationdate><title>Effect of copper addition and heat treatment on the depth dependence of the nanoindentation creep of aluminum at 300 K</title><author>Bose, Bipasha ; Klassen, R.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-e269t-6d71dd7a9aabb256ccf2653f778d3384ecc94ac71146da2a318b4723204027a23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Aluminum</topic><topic>Applied sciences</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Creep</topic><topic>Exact sciences and technology</topic><topic>Heat treatment</topic><topic>Mechanical and acoustical properties of condensed matter</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Mechanical properties of solids</topic><topic>Metals. Metallurgy</topic><topic>Nanoindentation</topic><topic>Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Bose, Bipasha</creatorcontrib><creatorcontrib>Klassen, R.J.</creatorcontrib><collection>Pascal-Francis</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Bose, Bipasha</au><au>Klassen, R.J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of copper addition and heat treatment on the depth dependence of the nanoindentation creep of aluminum at 300 K</atitle><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle><date>2009-01-25</date><risdate>2009</risdate><volume>500</volume><issue>1</issue><spage>164</spage><epage>169</epage><pages>164-169</pages><issn>0921-5093</issn><eissn>1873-4936</eissn><abstract>Constant-load indentation creep tests were performed on pure aluminum and aluminum 4
wt% copper at 300
K to assess the influence of indentation depth, copper addition, and heat treatment upon the indentation creep rate. The stress dependence of the average indentation creep rate could be expressed for all the samples tested in terms of a mechanism of obstacle-limited dislocation glide. The calculated activation energy showed the same dependence upon indentation stress for all the conditions investigated.
We therefore conclude that the indentation creep rate is limited by dislocation/dislocation interactions regardless of indentation depth, copper addition, or heat treatment. The presence of 4
wt% copper and heat treatment, however changes, the dislocation density, and hence the spacing of the dislocation–dislocation interactions.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.msea.2008.09.018</doi><tpages>6</tpages></addata></record> |
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| ispartof | Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2009-01, Vol.500 (1), p.164-169 |
| issn | 0921-5093 1873-4936 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_35374906 |
| source | Elsevier ScienceDirect Journals |
| subjects | Aluminum Applied sciences Condensed matter: structure, mechanical and thermal properties Creep Exact sciences and technology Heat treatment Mechanical and acoustical properties of condensed matter Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Mechanical properties of solids Metals. Metallurgy Nanoindentation Physics |
| title | Effect of copper addition and heat treatment on the depth dependence of the nanoindentation creep of aluminum at 300 K |
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