Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints
Impact properties of solder ball joints with Sn-9mass%Zn and Sn-3mass%Ag- 0.5mass%Cu lead-free solders were investigated under aging at 423 K. In the case of the joints with Cu electrodes, both Sn-9Zn and Sn-3Ag-0.5Cu joints have similar impact forces before aging. For the Sn-3Ag-0.5Cu joint, fractu...
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| Veröffentlicht in: | Key engineering materials 2008-01, Vol.385-387, p.429-432 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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